ABSTRACT Autocatalytic electroless copper plating is widely applied in the printed circuit board industry. In this study, the micro-contact printing technique is applied to directly fabricate the seeding layer for electroless deposition on glass substrate. Now, we can successfully fabricate copper pattern with feature size 10µm lines and separated by 10µm on glass substrate by micro - contact printing, and silver pattern with feature size 0.8µm lines and separated by 0.8µm on glass substrate. We also use the methods of soft embossing and sol-gel to fabricate glass substrate with specific roughness which could be controlled and discuss the relations between roughness of glass substrate and the adhesion of copper layer.