摘要
近年來，由於電子元件的性能不斷提昇，所產生的發熱功率也隨之增加，加上製程技術的進步，使其體積愈來愈小，溫度容易過高而影響其性能。因此，本研究係針對熱管規劃完整的實驗流程與量測方式，藉由動態加熱實驗與穩態性能測試，對熱管進行相互比較分析。 在性能評估方面，提出一個全新的動態性能評估概念，利用此概念可將量測時間縮短為十至十五分鐘，所得的動態性能與穩態性能有相同趨勢。利用此方式能節省量測時間以及簡化實驗設備，以供日後測試熱管性能的改良方向。 對於熱管動態檢測，係利用實驗參數對熱管做詳盡分析，進而建立其判斷準則與檢測標準流程。實驗參數包括毛細結構、工作流體填充率以及形狀變化。此外，利用數值分析與實驗量測，建立熱管在動態加熱下之理論模式，可以預測熱管動態反應，有助於實驗參數之建立，降低傳統方式所造成的時間成本。
並列摘要
In recent years, the growth of chip performance and manufacturing technology results in high power dissipation and high operating temperature. Therefore, this research is focusing on setting up the experiment methodology and measurement procedure for heat pipe. By using the dynamic heating experiment and steady performance test to compare and analysis the heat pipe response. For performance estimation, using the result of dynamic temperature changes to come out with a new concept for dynamic performance. This concept could shorten the measuring time to 10-15 minutes and the dynamic and steady performance would be similar. In addition, this concept could save measuring time and simplify research applications. For heat pipe test, by experimental parameters to analysis heat pipe to make criterion and standard testing procedure. The main experimental parameters include the wick structure, fill ratio and different shape of heat pipe. In addition, by numerical analysis and measurements to find out the dynamic temperature response of heat pipe, and then set up experimental parameters. Under these conditions, we could reduce the time on testing parameters and analysis principles.
參考文獻
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