本文研究主軸為鈦鎳形狀記憶合金薄膜之特性量測與提出無閥式鈦鎳形狀記憶合金薄膜微型幫浦之相關製程設計。文中微型幚浦的致動源為鈦鎳薄膜,而擴散器為微型幫浦流道設計的主體。 鈦鎳薄膜性質量測方面:以掃描式電子顯微鏡(SEM)觀察薄膜破面之柱狀晶結構,以微差熱掃描分析儀(DSC)量測鈦鎳薄膜之變態點溫度,以能量分散分析儀(EDS)作鈦鎳薄膜成份之定性分析,以電子微探分析儀(EPMA)作鈦鎳薄膜成份精確之定量量測,以薄膜加壓設備定性量測薄膜之形狀記憶效應(SME)。 微型幫浦製程方面:針對擴散器設計,並以有限元素法分析鈦鎳薄膜受壓力後之內部應力值作為設計微幚浦致動腔室之參考,文中亦詳細提出無閥式微型幚浦製程設計之藍圖,最後配合陽極接合試驗將流道與鈦鎳薄膜致動腔室作相關接合實驗。 關鍵詞:形狀記憶合金、形狀記憶效應、擴散器、陽極接合
This thesis focuses on physics properties measurement of Ti-Ni thin film and We designd processes of non-valve shape memory alloy thin film micropump. We used Ti-Ni thin film as actuating source and the diffuser is the main part of micropump’s flow channels. We used Scanning Electron Microscope to observe the cross section of Ti-Ni thin film, Differential Scanning Calorimeter to measure the transformation temperature of Ti-Ni thin film, EDS to do the composition qualitative analysis of Ti-Ni thin film, Electron Probe X-ray Microanalysis to do the precise composition quantitative analysis of Ti-Ni thin film, clamp apparatus designed for Ti-Ni thin film to do qualitative analysis of Ti-Ni SME property under pressure. We also designed diffuser components as a part of our flow channels. We used FEM software to analyze the inner stress of the thin film under pressure 0.1MPa. In this thesis, we brought up the non-valve micropump processes in detail. Finally, we use anodic bonding technics to assemble the flow channels and the actuation chamber together. Keywords:Shape Memory Alloy, Shape Memory Effect, Diffuser, Anodic Bonding