結合計算機結構暨實體設計之溫度感知輔助設計

Joint Exploration of Architectural and Physical Design Spaces with Thermal Consideration

吳彥緯(Yen-Wei Wu)

指導教授 ： 楊佳玲

共同指導教授 ： 張耀文

國立臺灣大學/電機資訊學院/資訊工程學研究所/碩士(2005年)

https://doi.org/10.6342/NTU.2005.10430

摘要

在深次微米的製程技術環境中，溫度成為設計處理器的重要考量因素。處理器的溫度往往受到下面兩個因子的影響：每個處理器元件的耗電功率及處理器內元件的幾何位置擺設。因此，在溫度感知的微計算機結構設計中，吾人需妥善考慮處理器內元件的幾何位置擺設對溫度所造成的影響。在這篇論文當中，我們從微計算機結構層的觀點，提出一個溫度感知的「處理器元件幾何位置擺設方法」架構。透過這個架構，計算機結構設計者能夠結合實體設計暨計算機結構領域，找出一個滿足溫度限制且最佳化效能的處理器元件幾何位置擺設。

關鍵字

溫度 ； 效能 ； 計算機結構

並列摘要

Heat is a main concern for processors in deep sub-micron technologies. The chip temperature is a®ected by both the power consumption of processor components and the chip layout. Therefore, for thermal-aware design it is crucial to consider the thermal e®ects of di®erent °oorplans during micro-architectural design space exploration. In this thesis, I propose a thermal-aware architectural °oorplanning framework. With the aid of this framework, an architect can explore both physical and architectural design spaces simultaneously to ‾nd an architecture and the corresponding chip layout that optimizes performance under a thermal limitation.

並列關鍵字

Thermal ； Performance ； Architecture

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