微元件內部垂直輪廓量測系統之研究

吳秉翰(Bing-Han Wu)

指導教授 ： 廖運炫

國立臺灣大學/工學院/機械工程學研究所/碩士(2005年)

https://doi.org/10.6342/NTU.2005.02800

摘要

高深寬微元件之內部垂直輪廓因具有高而深的內壁與狹窄的空間，以一般的量測方式，如工具顯微鏡與三次元量床等，難以達到內部輪廓量測的目的。本論文提出一新型、結構簡化之電容感測式探針，配合自行開發的量測系統進行具有高深寬比特徵的微孔垂直輪廓量測。先估測量測系統的不確定度，再量測標準塊規的水平、垂直輪廓的真直度誤差到達1um。最後量測出直徑1.5mm金屬孔與直徑1.0mm陶瓷眼模孔的垂直輪廓，達到的最大量測深度為12.8mm。

關鍵字

內部垂直輪廓量測系統 ； 電容感測 ； 高深寬比輪廓

並列摘要

Measuring the vertical profile inside a micro part is a difficult but important task, especially when micro holes are frequently encountered nowadays. However, when the interior dimension of the micro part is smaller than 1mm, the smallest dimension of the pin-ball probe currently available for the coordinates measuring machines, there is practically no measuring apparatus available so far to serve the purpose. An approach by applying the capacitance-sensing principle to measure the interior vertical profile of a high aspect ratio micro part, such as a hole with 1.0mm diameter, is proposed and implemented. Experiments are conducted and the measurement accuracy is able to be reached to about 1um. The structure and the circuitry of the developed measuring system are both simple. Besides, the developed system is innovative and has a great potential for industrial application. Further study toward the measurement and assessment of the circularity and cylindricity of micro holes by the developed system is underway.

並列關鍵字

Vertical profile measuring system ； Capacitance-sensing principle ； High aspect ratio profile

參考文獻

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