銅與氧化鋁接合與其界面性質之研究

Study on Copper/Alumina Joining and the interfacial properties

李劭寬(Shao-Kuan Lee)

指導教授 ： 段維新

國立臺灣大學/工學院/材料科學與工程學研究所/碩士(2009年)

https://doi.org/10.6342/NTU.2009.02993

摘要

金屬與陶瓷彼此間性質上的差異往往造成在接合上的困難。本實驗主要研究金屬銅/氧化鋁接合之微結構與機械性質，藉共晶接合法（eutectic bonding process）於銅/氧化鋁界面形成銅-氧化亞銅(Cu-Cu2O)共晶液相（共晶點: 1065℃），改善在氧化鋁基板上之潤濕行為，獲得接合良好之界面。
利用不同的預氧化製程獲得多種不同表面氧濃度之銅箔，升溫至1075℃與氧化鋁進行接合。經微結構觀察、壓痕測試，以及四點彎曲強度測試的結果，進行不同氧濃度下，所獲得之相對界面結構以及對性質之影響，除此之外，還進行熱力學分析以及評估本實驗系統之殘留應力。雖然介面研究理論之穩態平衡荷重並無在荷重-位移曲線中所觀察到，仍可利用其裂痕於界面傳播時之特徵荷重值進行穩態應變能量釋放速率之計算。發現界面強度隨著氧濃度提升而增加。結果也顯示在銅/氧化鋁界面有化學成分與彈性常數之梯度變化。
於強度測試時以即時攝影觀察之方法，助於我們了解試片破壞之過程，也能對破壞機制做較深入的探討。本研究在銅與氧化鋁界面上發現一層CuAlO2反應相，此相之生成提昇了黏附強度，尤其是具不連續CuAlO2相之界面擁有最高之界面強度。

關鍵字

銅/氧化鋁界面 ； 共晶接合法 ； CuAlO2 ； 四點彎曲測試 ； 接合強度

並列摘要

In the present study, copper is directly bonded to alumina, and its interface characteristics are investigated. The oxygen plays an important role on the joining of metal-to-ceramics, the interfaces between alumina and copper with different oxygen concentrations have been investigated. In order to introduce various oxygen concentrations into copper, various pre-oxidation routes are adopted. The Cu-Cu2O eutectic bonding of copper to alumina is achieved at 1075℃ in nitrogen atmosphrere. The adhesion strength of Cu/Al2O3 interfaces is determined via a four-point bending test. Although a load plateau in the load-displacement curve is not observed, the strain energy release rate can still be calculated from the curve. The strain energy release rate at interface increases with the increasing of oxygen concentration in copper. The elastic modulus and composition gradients are exhibited across the Cu/Al2O3 interfaces with various oxygen contents. Furthermore, the thermodynamics and residual stress analyses are also used to evaluate the effect of interface reactions on the adhesion strength.
In-situ observation during fracture of Al2O3/Cu/Al2O3 sandwich specimens was conducted to understand the fracture process. The adhesion strength of copper-to-alumina joints is improved with increasing oxygen concentration in copper. A delafossite reaction phase, CuAlO2, is found at interface. The presence of CuAlO2 strengthens the Cu/Al2O3 interfaces, and the continuity of such reaction phase may also affect the interfacial strength.

並列關鍵字

Cu/Al2O3 Interface ； Eutectic bonding ； CuAlO2 ； Four-point bending test ； adhesion strength

參考文獻

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