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  • 學位論文

殺菌劑對304不鏽鋼表面生物膜成長及腐蝕行為之影響 –以硫酸鹽還原菌為例

The use of Biocide to Control the Number and Activity of Sulfate Reducing Bacteria Biofilm and Corrosion Behaviors of 304 Stainless Steel

指導教授 : 李岳聯

摘要


本研究目的在尋找毒性較低且環保之殺菌劑,降低防污塗料毒性及防止環境重金屬汙染。藉由微生物特性分析硫酸鹽還原菌之生長曲線,並檢測殺菌劑之抑菌性,接著進行浸泡分析,使用光學顯微鏡、掃描式電子顯微鏡及共軛焦雷射掃描顯微鏡,觀察隨時間變化硫酸鹽還原菌之生物膜在金屬表面附著情形以及殺菌劑之效果,最後藉由電化學分析,由電化學數據判斷細菌對金屬底材造成的腐蝕及殺菌劑之抑菌性,最後使用光學顯微鏡和掃描式電子顯微鏡證實驗結果。   本研究第一部分為微生物特性分析,本實驗之菌種為硫酸鹽還原菌,量測並繪出其原始生長曲線,加入本研究選用之殺菌劑,十二烷基二甲基苄基氯化銨 (Benzyldimethyldodecyl ammonium Chloride),測量添加不同濃度下對硫酸鹽還原菌生長抑制的效果,藉此得出殺菌劑的最小抑制濃度(MIC,Minimum inhibitory concentration)。經濃度測試結果顯示,十二烷基二甲基苄基氯化銨具有抑制硫酸鹽還原菌生長的效果,其最小抑制濃度約為25ppm。 實驗第二部分為浸泡分析,由光學顯微鏡、掃描式電子顯微鏡及共軛焦雷射掃描顯微鏡觀察出接種硫酸鹽還原菌之金屬表面覆蓋一層生物膜,隨浸泡時間增加生物膜之厚度也增加許多,而添加殺菌劑之金屬表面活細胞明顯減少許多且無生物膜附著之情形。   實驗第三部分為電化學分析,由動電位極化曲線結果顯示,當硫酸鹽還原菌附著在底材表面隨著時間增長將會造成腐蝕電流密度大幅增加,而添加殺菌劑之腐蝕電流密度雖然也增加,但幅度相對低且相對緩慢,藉由光學顯微鏡及掃描式電子顯微鏡觀察出硫酸鹽還原菌確實會造成金屬底材孔蝕之現象,同樣地添加殺菌劑之金屬表面孔蝕之情形相對較緩和。

並列摘要


The aim of this study was to reduce the toxicity of antifouling coatings and to prevent heavy metal pollution in the environment and finding a biocide which was less toxic and eco-friendly. Detecting the bactericidal activity of compound by microbial experimental, determined whether bacteria attached, biofilm formation and bactericidal activity by electrochemical experimental. Finally, Optical microsocope, SEM and CLSM were used to certifiy previous experiments. The first part was microbial experiments, the experimental results verify the ability of inhibit the sulfate-reducing bacteria (SRB) growing of biocide, Benzyldimethyldodecyl ammonium chloride (DBMDAC), and detecting growth inhibition effect in different concentration, the minimal inhibitory concentration is 25ppm. The second part was immersion experiments, according to the Optical Microscope (OM), Scanning Electron Microscope (SEM) and Confocal Laser Scanning microscope (CLSM) results, there was no biofilm on the surface which added DBMDAC in the medium. The final part was electrochemical experiments, in dynamic potential polarization curve, attachment of bacteria causing current density increased greatly. The reason of this situation was pitting which was under the biofilm. However, the current density of test medium added BDMDAC increased slowly and the current density of sterile medium was stable.

參考文獻


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