- 學位論文
雕模放電加工鑽石修整器製程技術之開發研究
Research and Development on the Manufacturing Process of Diamond Conditioner for Die-Sinking EDM
摘要
近年來半導體晶片不斷地朝向小體積、高電路密集度、快速、低耗電方向發展，化學機械拋光(Chemical Mechanical Polishing, CMP)為目前最廣泛地應用在全面性平坦化的製程。在化學機械拋光製程中，拋光墊(pad)上的溝紋會隨使用時間而消逝，逐漸失去拋光功能。為了維持拋光速率及效率，必須使用鑽石修整器(diamond conditioner)適時地修整拋光墊，清除堆積在拋光墊表面微細孔洞內的雜質並重新產生溝紋。目前業界廣泛使用的鑽石修整器採用硬焊的方式將鑽石顆粒排成陣列形式。 本文欲提出一合乎大量生產的ADD
並列摘要
Semiconductor chip develops toward smaller volume, high density circuit, and low power consumption in recently years. CMP is broadly applied to planarization process in large surface. During CMP process, polishing pad lose it function with time, therefore, diamond conditioner need to be dressed in order to scrape glazed pad and regenerate new asperities on pad. Diamond conditioner is composed of artificial diamond brazed on substrate and arranged in matrices. This article shows a new mass production manufacturing process for diamond conditioner. Using experiment to realize whether die-sinking electric discharge machining can make pyramid structure on PCD surface or not. This article is composed of three parts: (1) Designing and manufacturing electrode. According to property of copper electrode which is suit for smaller current in EDM made by WEDM. (2) Searching for electric discharge parameters. According to voltage and current waveform observed by oscilloscope, not only try to find parameters which waveform is almost normal but also get lower electrode consumption and less machining. (3) Machining procedures of micro pyramid on PCD are divided into six parts and made it by EDM. Micro pyramid on PCD are successfully made by this manufacturing process which is shown in this article, the smallest difference of tip height is about 7μm in a row, others are less than 20μm.