In this thesis, the Si mold containing inverted pyramid patterns with 54.74 degree between {111} planes and (100) plane was manufactured by photolithography process and Si (100) was prepared with KOH etching process for the anisotropic wet etching process. The polydimethylsiloxane was used to reprinted the structure of the si mold. Because polydimethylsiloxane was elongated easily, polydimethylsiloxane was forced to elongate single-axially to change the degree of the angle between {111} planes and (100) plane and the dimension of the structure. By using UV curing technology, the structure of the elongated PDMS would be reprinted. And then the electroforming technology was used to reprinted the UV curing agent with the structure of the inverted pyramid patterns for being the mold of polymer hot embossing. Finally, polymer was used for optical test and get diffraction pattern of the photo.