以浮動拋光法拋光精密圓柱件之研究

Precision Polishing of Cylindrical Specimen by Float Polishing Method

郭家維(Chia-Wei Kuo)

指導教授 ： 趙崇禮

淡江大學/工學院/機械與機電工程學系碩士班/碩士(2008年)

https://doi.org/10.6846/TKU.2008.00800

摘要

本論文之研究目的在建立一套能對於圓柱型試件進行表面品質改善的精密拋光系統，透過實驗與觀察了解對圓柱型試件進行拋光的特性與表面品質的改善情況，並建立表面粗糙度、材料移除率對於各參數的關係。
根據實驗觀察，速度、磨粒大小、試件與拋光工具之間隙影響著材料移除的速率，而材料移除速率越快會使得表面粗糙度的改善更有效率、更快速，並且可透過磨粒磨耗半經驗材料移除公式大約預測出材料之移除率；在表面粗糙度改善方面使用粒徑0.3μm之磨料、主軸轉速10000rpm、與拋光工具之間隙0.5mm能將試件表面粗糙度由13nm Ra 降至2nm Ra，達到表面改善之目的，並且真圓度與圓筒度也能改善。

關鍵字

拋光 ； 圓柱型試件 ； 浮動拋光 ； 滾筒拋光

並列摘要

This research aimed to design and develop a polishing system for precision polishing cylindrical specimen to nanometer surface finish. An experimental polishing system was built in the present study to polish stainless steel and nickel plated specimens with various polishing compounds. The polished specimens were subsequently examined by Alfa-step, OM and SEM for surface finish, morphology and microscopic analysis respectively. The obtained surface condition and material removal rate were correlated to the polishing parameters such as rotation speed, abrasive concentration, and abrasive grit size for the improvement of the polishing effect. Cylinders of 5mm in diameter were successfully polished to a surface roughness better than 2nm Ra in several hours without damaging the roundness and cylindricalness using abrasive of 0.3μm, 10000rpm polishing speed and 0.5mm gap distance between polisher and the specimen. A semi-empirical model of polishing was also developed in the study for predicting the materials removal rate.

並列關鍵字

Polishing ； Cylindrical specimen ； Float polishing ； Cylinder polishing

參考文獻

[8] W. Li, D.W. Shin, M. Tomozawa, S.P. Murarka, “The effect of the polishing pad treatment on the chemical mechanical polishing of SiO2 film,” Thin Solid Films, Vol. 270, 1995, pp. 601-606.

[9] A.A. Yasseen, N.J. Mourlas and M. Mehregany, “Chemical mechanical polishing for polysilicon surface micromachining,” Journal of the Electrochemical Society, Vol. 144, 1997, pp. 237-242.

[10] J. Bai, Y.W. Zhao, Y.G. Wang, “A mathematical model for material removal and chemical–mechanical synergy in chemical–mechanical polishing at molecular scale,” Applied Surface Science, Vol.253, 2007, pp. 8489-8494.

[11] J. Luo, and D.A. Dornfeld, “Material removal mechanism in chemical mechanical polishing: theory and modeling,” IEEE Transactions, Vol.14, 2001, pp. 112-132.

[13] S.F. Soares, “Float-polishing process and analysis of float polished quartz,” Applied Optics, Vol.33, 1994, pp. 89-95.