Cu/(SiC)p金屬基複合材料低危害性接合製程之研究

Study on the low hazardous joining process of Cu/ (SiC)p metal matrix composites

張哲瑜(Che-Yu Chang)

指導教授 ： 莊正利

中山醫學大學/健康管理學院/職業安全衛生學系/碩士(2021年)

https://doi.org/10.6834/csmu202100029

摘要

金屬基複合材料因具有高強度、高導熱、耐腐蝕等優異的特性，目前已廣泛應用於航太航空、軍事、汽車等工業中，但在製造的過程中，由於金屬基材與陶瓷強化材之間的潤溼性較差及界面強度較弱，會造成材料的強度弱化。此外，金屬基複合材料的接合製程中，目前主要以傳統熔銲製程為主，在製程上需將金屬基材加熱至熔融狀態進行接合，而此製程易產生高溫、強光、金屬燻煙等危害因子，提高勞工曝露於危害因子的風險。本研究擬以銅金屬為基材，碳化矽為強化材，製成銅基碳化矽複合材料，並透過無電鍍銅技術，將碳化矽強化材上鍍著銅膜，改善金屬基材與陶瓷強化材間潤溼性不佳的問題，並增強兩者間的界面強度，最後使用低危害性的熱壓接合製程降低接合時的溫度，減少傳統熔銲製程中容易產生的危害，增加製程的安全性來保障勞工的健康及安全，並探討較佳的接合負荷與接合溫度來增強銅基碳化矽複合材料的接合強度。研究結果顯示成功將碳化矽粉末上鍍著均勻銅膜，並使碳化矽粉末的流動性增加。此外，透過將碳化矽粉末進行無電鍍銅處理，也成功改善碳化矽強化材易團聚之缺陷，減少碳化矽分佈不均的現象，並提升銅基材與碳化矽強化材的界面強度，進而提高銅基碳化矽複合材料之機械性質。最後，也以熱壓接合製程成功接合銅基碳化矽複合材料，並在接合負荷220 MPa，接合溫度550 ℃，接合時間30分鐘的接合參數下有較佳的接合強度，而無電鍍銅技術也同樣有效提升接合試片中，銅基材與碳化矽強化材的潤溼性，增加銅基材與碳化矽強化材間的界面強度，提升接合母材與接合層間的接合品質。熱壓接合製程及無電鍍銅技術的運用，有效降低了接合製程的溫度，減少勞工的危害風險，提高製程的安全性，並改善金屬基複合材料潤溼性不佳的缺點，提升接合的品質。

關鍵字

熱壓接合製程 ； 無電鍍銅 ； Cu/( SiC)p金屬基複合材料

並列摘要

The metal matrix composite (MMC) has been widely used in aerospace, military, automotive and other industries for its several great properties in high strength, high thermal conductivity, high corrosion resistance and other excellent characteristics. However, a poor wetting property between the metal matrix and the ceramic reinforcement would lead to degrade the mechanical and physical properties. Furthermore, several defects, cracks, voids and reinforcements aggregated would be existed for MMCs joining using the traditional fusion welding. The hazards of high temperature, radiation, toxic gases and metal fume would be formed to increase the operational risk. It is essential to development a joining technology to improve the joining performance and to reduce the operational risk for MMCs joining. A solid-state bonding process is selected to join MMCs in this study, the joining temperature of MMCs would be reduced, and the operational risk can be avoided. The electroless copper plating technology is applied to deposited copper film on the SiC reinforcements to improve the wetting between the copper matrix and the SiC reinforcements.For Cu/(SiC)p MMCs joined, the shear test is conducted to detect the joining strength, and optical microscopy (OM) and scanning electronic microscopy (SEM) were employed to observe the microstructure and surface morphology. The experimental results show that a uniform copper film is deposited on the SiC under adequate parameters, and the fluidity of SiC is thus improved. No defects of SiC reinforcements aggregation are found in the microstructure of Cu/SiC MMCs for SiC reinforcements pre-deposited copper film. A higher joining strength of MMCs is achieved for the SiC pre-deposited copper film than those without depositing Cu film. The fracture morphology of Cu/SiC MMCs shows that SiC is pull-out and no residue of copper on the SiC after shear test, indicating a weak bonding of copper matrix and SiC reinforcements is obtained. In contrast to a weak bonding is obtained for SiC without pre-deposited copper film, the fracture morphology of Cu/SiC MMCs for SiC pre-deposited copper film after shear test display the copper matrix still sticks on the SiC reinforcement, indicating the adhesive strength between the copper matrix and SiC reinforcements are improved. This observed result can be used to interpret that joining strength of Cu/SiC MMCs for SiC pre-deposited copper film is higher than those without pre-depositing copper film. With the adequate parameters, a sound joining with sufficient joining strength of Cu/SiC MMCs can be achieved using a hot-pressing joining combined the SiC reinforcements electroless-plating copper film.

並列關鍵字

hot-press bonding process ； electroless copper plating ； Cu/(SiC)p metal matrix composite

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