高導熱矽膠複合材料之開發研究

The Study of High Thermal Conducting Silicones Composites

葉俊廷(Chun-Ting Yeh)

指導教授 ： 王玉瑞 ； 王錫福

國立臺北科技大學/工程學院/材料及資源工程系所/碩士(2006年)

摘要

高導熱矽膠複合材料是利用不同的矽膠基材填充各式導熱材料，並以混煉法製成。本實驗係探討不同基材與不同填充材及其含量、粒徑大小、填充粒子的表面改質、兩種填充材混合等因素，對於導熱矽膠製程之影響性及對熱傳導性質與其他物理性質之影響。
實驗結果發現導熱矽膠複合材料的導熱性能最終是由矽膠基體和高導熱填充物綜合作用決定的。填充量低於40 vol.%熱導值並無太大的變化，當填充量體積百分比(volume%)達到一定程度時，填充材料的相互接觸而形成導熱鏈，熱導值急劇上昇。室溫硫化矽橡膠填充粒徑大的粉體、填充表面改質的粉體或D粉體均可提高填充材料的總負荷量。當總填充含量達到75 vol.%時，可獲得最高的導熱性，複合材料的導熱性可達到基質的36倍(~5.8 W/mK)。本實驗研發的導熱矽膠複合材料已達到國際標準1.5 W/mK。

關鍵字

熱界面材料 ； 熱傳導係數 ； 矽酮 ； 陶瓷 ； 複合材料

並列摘要

High thermal conducting silicone composites made of different silicone as a material mixing with various kinds of ceramic powders with higher thermal conductivity as a filler was studied in this paper.This reseach focued on the effects of various fillers and their content , particle size of powders, surfaces modification on the processing and thermal conductivity of the silicone composites.
The results show that the thermal conductivity of high thermal conducting silicones composites is determined by silicone matrices and high thermal conducting fillers. When the filling content is less than 40 vol.%, the thermal conductivity has no significant change. while the volume percentage reaches a certain level, the filler particles contact each other and form thermal conducting chain, the thermal conductivity increases rapidly. RTV silicone rubber mixing with larger grain size powder, powders with surface modification, and D powder could improve the total load of the filler. When the total filler reaches 75 vol.%, the highest thermal conductivity could be achieved. The thermal conductivity of composites could reach 36 times (~5.8 W/mK) of the metrix. The high thermal conductivity of silicones composites made in this work is higher than 1.5 W/mK of international standard.

並列關鍵字

Thermal Interface Material ； Thermal Conductivity ； Silicone ； Ceramic ； Composites

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