- 學位論文
低溫液冷式電子散熱系統研製
The Development of Low Temperature Liquid-cooled Electronic Heat Sinking System
摘要
隨著人類文明的進步，科技的發展，電子元件或微電腦控制系統在我們生活中是隨處可見的，已經成為了不可或缺的工具，但新製程及設計技術不斷提升，運算裝置之體積不斷的縮小，導致發熱密度增加，若無法有效的將廢熱移除，在提升運算速度上，將會形成一大阻礙。在大部分文獻中關於液冷式散熱系統之研究主要以小功率為主且操作溫度都在常溫，而發現市面上較少機組是冷卻大面積且高功率系統，因此，本研究開發低溫液冷式電子散熱系統，利用冷凍系統搭配液冷式循環散熱模組，來對大面積、高發熱量、且運作溫度需求低的高功率系統降溫，並設計總功率將近1kW之電熱板充當模擬熱源，並進行製作與測試，探討此低溫液冷式散熱系統是否能滿足高功率熱源的散熱問題。 結果顯示此低溫液冷式電子散熱系統約熱機30分鐘即可投入降溫且第二版的散熱效果較第一版佳，而在加熱將近1kW的狀況下系統依然可以有效的帶走加入的熱源，另外可藉由壓縮機或液體輸送泵的啟停來做恆溫控制，溫控在所需求的溫度點上，以滿足實際系統運轉的散熱效果。
並列摘要
Under advancement of technology, electronic modules or microcomputer control systems are widely used in our daily life. As new process and design technology develop, the size of computing devices has become smaller, thus, the radiation density has increased. If the waste heat is not removed effectively, there will be a major obstacle to the improvement of computing speed. Most of studies on liquid cooling systems aim at low power, and the operating temperature is normal temperature. Few machine sets on the market are of large area cooling and high power systems. Therefore, this study developed a low temperature liquid cooling system, used refrigeration system and liquid-cooled circulating heat sinking module to cool high power systems with large area, high heating capacity and low operating temperature. This study designed and tested an electric hot plate with total power of nearly 1kW as the simulated heat source, and discussed whether this low temperature liquid cooling system can solve the heat removal of high power heat source.The results showed that the low temperature liquid cooling system can implement cooling after about 30 min warming up, and Version II has better cooling effect than Version I. When it is heated by 1kW, the system still can remove the added heat source effectively. In addition, thermostatic control can be implemented by switching on or off the compressor or liquid delivery pump, and the temperature is controlled at the required temperature spot to meet the cooling effect of real system operation.