模流分析應用於手機記憶卡連接器之翹曲研究

Using Mold Flow Analysis to Study the Warpage of Micro SD Card Connector

簡宏益(Hong-Yi Chien)

指導教授 ： 韓麗龍

國立臺北科技大學/機電學院/製造科技研究所/碩士(2012年)

摘要

本論文是利用田口式品質設計法配合模流分析軟體探討手機記憶卡連接器(micro SD card connector)因結構設計差異對於翹曲(warpage)之影響。射出模具的模穴設計為一模四穴，進澆點是以單點潛式澆口(submarine gate) 的型式，工程塑料採用液晶高分子聚合物(liquid crystal polymer, LCP)。所選用的直交表為L18直交表，共選定八個控制因子，分別為產品的結構、射出流速、模具表面溫度、熔膠溫度、保壓時間、保壓壓力、澆口大小以及塑料型號，並加入熔膠溫度及模具表面溫度的變化作為干擾因子進行模流分析。經由預測實驗與確認實驗的過程，得到Ｚ軸方向最小翹曲量之最佳參數的組合。
確認實驗結果顯示，最佳化製程在產品有補強肋條的結構、流速130 mm/s、模具表面溫度80 ℃、保壓時間0.05 s、塑料LCP E130i的條件下，Ｚ軸平均翹曲量為0.055 mm，S/N比為25.2，比原始製程之Z軸平均翹曲量為0.087 mm，S/N比21.2更能符合翹曲量望小的品質特性，也符合連接器對於平面度(flatness)小於0.080 mm的要求。

關鍵字

記憶卡連接器 ； 翹曲 ； 潛式澆口 ； 平面度

並列摘要

Taguchi Method was adopted in this thesis by using Moldflow analysis software to study the impact on the warpage due to the difference in the design for the structure of micro SD card connector. The mold was designed in a 4-cavity layout, the gate number and gate type were one gating of submarine gate, and liquid crystal polymer (LCP) was used in this study. In the study, Orthogonal Arrays was a L18 and the eight control factors were selected including the product structure, flowing velocity, the mold surface temperature, melt temperature, packing time, packing pressure, the gate size and the plastic material type. Accordingly, the change in temperature of the joined melt and mold surface was chosen as the interference factors for mold flow analysis. In the process of the prediction experiments to confirmation experiments, it was observed Z-direction minimum warpage as the optimized combination of parameters.

Based on the result of study, the optimized condition of the production process were the micro SD card connector joined with the strengthening rib, the velocity of flowing was at 130 mm/s, the mold surface temperature was 80 ℃, the packing time was in 0.05s, the plastic materials was LCP E130i, the warpage in Z -direction was 0.055 mm and S/N ratio was 25.2. Comparing to the existing production process under the warpage in Z-direction as 0.087 mm, S/N ratio as 21.2, it is found that the result can meet the quality characteristics of smaller-the-better and also the demand for the flatness of connector is smaller than 0.08 mm.

並列關鍵字

Micro SD card connector ； warpage ； submarine gate ； flatness

參考文獻

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