This paper is to introduce a technique which evaluates residual stresses of thin-films deposited on substrates using a white light shearing interferometer. The interferometer contains a white light source and Savart plate placed on a rotation stage. Where the Savart plate divides the wavefront reflected from the substrate into two laterally displaced ones, the interference pattern generated by the mutual interference of the divided wavefronts is modulated by an envelope function, and the curvature of the substrate is determined by examining the shifting of the darkest fringe of the pattern as the Savart plate is angularly scanned by the rotation stage. Once the curvatures of the substrate before and after thin-film deposition are sequentially determined, the Stoney equation is utilized to calculate the film stress on the substrate. A setup for realizing the interferometer was constructed. And the concept of this technique was verified by conducting this setup to examine the residual stresses of silicon substrates having CrN thin-films deposited on them.