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  • 學位論文

Savart剪切干涉儀在鍍膜殘留應力之量測

Savart Shearing Interferometer For Thin-Film Stress Measurements

指導教授 : 林世聰
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摘要


本文提出一種Savart白光剪切干涉儀,量測鍍膜在基板上之殘留應力。該干涉儀使用白光做為光源,Savart稜鏡置於旋轉平台上,光進入Savart稜鏡後被橫向剪切為兩道波前,由待測基板反射,其中被分割的兩道波前相互干涉,產生的干涉圖形為一包絡函數。由旋轉平台推動Savart稜鏡進行角度掃描,測得基板鍍膜前後的曲率,使用Stoney equation計算殘留應力。實驗結果顯示鍍膜厚度在500nm~5000nm之殘留應力,其鍍膜材料為CrN。

並列摘要


This paper is to introduce a technique which evaluates residual stresses of thin-films deposited on substrates using a white light shearing interferometer. The interferometer contains a white light source and Savart plate placed on a rotation stage. Where the Savart plate divides the wavefront reflected from the substrate into two laterally displaced ones, the interference pattern generated by the mutual interference of the divided wavefronts is modulated by an envelope function, and the curvature of the substrate is determined by examining the shifting of the darkest fringe of the pattern as the Savart plate is angularly scanned by the rotation stage. Once the curvatures of the substrate before and after thin-film deposition are sequentially determined, the Stoney equation is utilized to calculate the film stress on the substrate. A setup for realizing the interferometer was constructed. And the concept of this technique was verified by conducting this setup to examine the residual stresses of silicon substrates having CrN thin-films deposited on them.

參考文獻


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[12] 邱柏凱,薄膜之殘留應力分析,國家實驗研究院儀科中心簡訊 ,第77 期,2006。
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