透過您的圖書館登入
IP:3.19.30.232
  • 學位論文

高亮度微型投影機光源之熱傳效益改善研究

Improvement of Heat Transfer Performance for Light Source of High Brightness Pico Projector

指導教授 : 李金連

摘要


微型投影機最重要的核心元件是光學系統,目前其光源都是以發光二極體 (LED)為主,因此高功率LED 的散熱好壞影響微型投影機的品質,故本研究 提出一個結構簡單且低成本的散熱系統模型,並提供從事散熱模組的設計人員 一個參考的方向。 本研究基於散熱網的概念,設計一散熱系統以改善並簡化微投影機的高功率 LED、印刷電路板(PCB)與散熱片之導熱途徑。研究工具為有限體積分析軟 體FloTHERM,對該散熱系統作模擬熱場分析。結果顯示: 一、多個LED 可藉由調整銅箔的分布,來避免每顆LED 因接面溫度不同而造 成色偏影響光源品質。 二、在印刷電路板上銅箔須有足夠的厚度,導熱效果才會顯著。 三、改良結果使LED 接面溫度下降約8℃。 四、改變印刷電路板之銅箔材質為銀箔,達到更好的導熱效果。 五、用電腦數值模擬的可預測散熱結果,節省了大量的時間,避免不必要花費 與實驗。

並列摘要


The optical system is the most important components of the pico projector. The light source is a high power LED. Therefore, LED components affect the quality of the pico projector. This thesis proposes a simple and low-cost structure. A finite volume method package (FloTHERM) is used to analyze the temperature field of the Pico projector’s high power LEDs, Printed circuit board and heatsink. The results are as follows: 1. The thermal module method concept to improve and simplify the LED thermal transmission, and then explore the distribution and thickness for the the PCB top of the copper. 2. The results of the the multiple LEDs by adjusting the distribution of the copper, to avoid color shift affect the light quality. 3. The experimental data of the PCB copper thickness and LED junction temperature, we found that the copper must be enough thickness, and the heat conduction would be better. 4. This result is the LED junction temperature down to about 8℃. 5. The copper material can also replaced by silver, the LEDs thermal conductivity results will be better.

參考文獻


9. 陳怡穎,投影機產業市場分析,2001。
29. 張睿傑,LED 製程及關鍵材料簡介,三連科技,2008。
1. Matthew S. Brennesholtz and Edward H. Stupp, "Projection Displays", 2008, pp.115-128.
3. Steve Taylor, "MCPCB and Thermal Interface Material Considerations for High Power LED Lighting Applications", 2010.
5. B. A. Zahn, "Evaluating Thermal Characterization Accuracy Using CFD Codes – A Package Level Benchmark Study of IcePakTm and FlothermR", 1998, pp.22-329.

延伸閱讀