不同參數及方式對硫酸/雙氧水微蝕效能之影響探討

The copper surfaces in manufacture printed wiring boards are coated with various kinds of organic films such as etch resists, plating resists, dielectric materials and solder masks. Whether these films are liquid forms or solid films, what we want is to create a secure bond to the copper surface. These experiments are designed to study the etching amount of copper surface in different parameters of acid. The research has three parts. The first part is to discuss the etching amount in the dip etching. The second part is to discuss the etching amount on machine experiment. The third part is to discuss the edge surface after dip etching and machine experiment. In dip etching experiments, we discover that etching amount is effected by temperature, Hydrogen Peroxide, copper and inhibitor but not sulfuric acid. And the etching amount rises as temperature, Hydrogen Peroxide and inhibitor rises but copper content is reverse. In machine experiments, we find that the etching amount rises as temperature rises but pressure and etching time are no obvious effects. In the edge surface, we find that surface roughness in machine experiment is better then dip etching.

並列關鍵字

Copper Clad Laminate ； Hydrogen Peroxide ； Sulfuric acid ； Etching

參考文獻

10.郭俊賢，“銅在酸性溶液之蝕刻研究”，台大化工所碩士學位論文，2003。

18.鮮祺振，“腐蝕控制”，財團法人徐氏基金會，1998。

7.Lionel Fullwood，“Factors Affecting Fine Line Reproduction in Dry Film Photoresist-Part 1-”，Insulation/Circuits，December 1981。

30.J.A.Scarlett,in”The Multilayer Printed Circuit Handbook”,

32.U.S.Patent#4,917,758;Mitsubishi Gas Chemical Company Inc.;Tokyo,

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不同參數及方式對硫酸/雙氧水微蝕效能之影響探討

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