雙管熱管及鰭片式熱板研製與散熱功率分析

Development and Thermal Power Measurements for the Dual-pipe Heat Pipe and the Fin Formed Flat Vapor Chamber Cooling Device

梁鈺聖(Yu-Sheng Liang)

指導教授 ： 丁振卿

國立臺北科技大學/機電學院/製造科技研究所/碩士(2014年)

摘要

本論文主旨在進行雙管熱管和鰭片式熱板的開發，雙管熱管研究方法以探討傳統熱管接上散熱鰭片後的熱傳導行為，其熱傳導行為與傳統熱管未搭配散熱鰭片的變化，進而開發雙管熱管達到恢復原始熱傳導行為，增加散熱器散熱功率為目的。本研究進行雙管熱管散熱裝置的散熱功率測定，並與傳統熱管進行比較。實驗過程中，自製雙管熱管，以一外徑φ6mm、長200mm之溝槽式熱管為基礎，在熱管絕熱段植入一外徑φ5.4mm、壁厚0.3mm、長60mm且熱傳導係數值較小的不鏽鋼網，量測雙管熱管的熱響應與散熱功率，實驗結果顯示，雙管熱管的熱響應比傳統熱管熱反應快，雙管熱管達均溫時只需要10秒為商用熱管所花時間的一半；另外，在最大散熱功率條件下，雙管熱管的散熱功率比傳統熱管增加約200%。鰭片式熱板研究方法以創新設計除去熱板與鰭片之間的熱阻，提高熱傳導。實驗過程中使用610x 80 x 0.4m3銅板作為基板的尺寸並與110PPI泡沫銅燒結為熱板毛細結構，燒結溫度為750℃持續30分鐘，在沒有氧氣且充滿氮氣條件下避免氧化增加熱阻，添加的工作流體為真空去離子水並在10-2torr的環境下進行填充。結果顯示，鰭片式熱板在自然對流下可散熱約57W，其中，晶片最高溫度在58℃以下。

關鍵字

雙管熱管 ； 鰭片式熱板 ； 最大散熱功率 ； 熱響應

並列摘要

This article is focused on developing the dual-pipe heat pipe and the fin formed flat vapor chamber cooling device. Dual-pipe Heat Pipe is to study change of the original
heat transfer property of the heat pipe in connection with the heat sink. This work aims to develop the dual-pipe heat pipe for recovering the original heat transfer property of the heat pipe and increasing the thermal power of the dual-pipe heat pipe cooler in comparison with the conventional heat pipe cooler. Experiments used a grooved heat pipe with outer diameter of 6mm and length 200mm as the base of the heat pipe. A steel mesh pipe with low thermal conductivity, outer diameter 5.4mm, thickness 0.3mm, length 60mm, is build in inner pipe, and embedded in adiabatic section of heat pipe. In process, the thermal response and thermal power of the dual-pipe heat pipe cooler are measured in comparison
with the conventional heat pipe cooler. The results show that the thermal response of the dual-pipe heat pipe cooler is better than the conventional heat pipe cooler. The dual-pipe heat pipe cooler needs ca. 10 sec to reach the steady state which is the half of the conventional heat pipe cooler. There is ca. 200% increment rate of thermal power for the dual-pipe heat pipe in comparison with the conventional heat pipe while the maximum heat transfer
rate is applied. Fin formed flat vapor chamber cooling device is an innovative design to remove the thermal resistance between vapor chamber and cooling fin, further hightened the thermal conductivity of cooling fin. In process, experiments used a dimension of 610 x 80 x 0.4mm3 copper plate as substrate and sintered with porous copper under 110PPI as wick structure of fin formed flat vapor chamber for 750℃, 30 mins, without oxygen, and filled with nitrogen conditions can avoid oxidation and increasing the thermal resistance. To be filled working fluid was DI water in vacuum environment of 10-2torr level. The results show that thermal power during the natural convection can be about 57W, where the chip highest temperature is controlled below 58℃.

並列關鍵字

Dual-pipe heat pipe ； Fin formed flat vapor chamber ； Maximum heat transfer rate ； Thermal response

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