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  • 學位論文

田口方法應用於筆記型電腦散熱模組參數設計

Applications of Taguchi Method on Design Parameters of Notebook Thermal Module

指導教授 : 簡良翰

摘要


本研究採用一款筆記型電腦,並依據實際尺寸、發熱源、配置,以數值模擬進行分析。實驗與模擬之CPU溫度相差為1.42℃,證實模擬方法之可靠性。以此模擬方法進行各項設計參數之模擬,並經由田口分析,歸納出最佳參數組合為:鰭片銅材質、鰭片長度27mm、鰭片厚度0.2mm、鰭片與出風口距離3.0mm、鰭片與風扇距離5.0mm、鰭片導流口寬度5.0mm、鰭片導流口高度5.0mm、出風口柵條寬度1.5mm。此最佳參數所模擬出之CPU溫度為92.72℃,比原始模組降低3.7℃,與最差結果相差7.85℃。由因子貢獻率分析,發現鰭片材質與鰭片厚度為最主要影響因子,其次為鰭片導流口寬度與鰭片長度。在固定鰭片間距1.2mm,並搭配前述最佳化參數,隨著鰭片厚度由0.2mm增加至0.4mm,其系統阻抗也隨之增加,因而使CPU溫度值隨之增高,對流效應減弱,此結果與文獻中針對散熱模組本身,而不考慮整個系統之結果一致。

關鍵字

田口方法 FLOTHERM CFD 散熱模組

並列摘要


In this study, numerical simulation has been conducted to determine the thermal performance of cooling devices for notebook computers according to actual configurations of size, heating power and locations. This simulation model is verified by experimental data. The maximum deviation of the CPU temperature between experimental result and simulation is 1.42℃. Simulations are performed with various design parameters of thermal modules for notebook computers. Based on the optimal parameter analysis by the Taguchi method, the best combination of thermal design parameters are: fin material = copper, fin length = 27 mm, fin thickness = 0.2 mm, gap between fins and vent = 3.0 mm, fin-to-fan distance = 5.0mm, diverging fin duct width = 5.0 mm, diverging fin duct height = 5.0mm, and rod width of vent screen = 1.5mm. The optimum combination resulted in a CPU temperature of 92.72, which is 3.7℃ lower than that of the original design, or 7.85℃ lower than the worst case. From the contribution factor analysis, fin material and fin thickness are found to be the most important parameters for improving the CPU's temperature, followed by the diverging fin duct width and fin length. With the optimum parameters and a fixed fin pitch of 1.2mm, the CPU temperature increases with increasing fin thickness from 0.2mm to 0.4mm. This is because the system impedance increases with increasing fin thickness and impairs the convection efficiency. This trend obtain by the simulation of the whole system agrees with the findings of the heat sink study in the literature.

並列關鍵字

Taguchi method FLOTHERM CFD Thermal module

參考文獻


Thermal Management Solution for a Ruggedized Pentium Based Notebook
“Advanced Cooling System Using Miniature Heat Pipes in personal computers”,
1998 IEEE Inter Society Conference on Thermal Phenomena, pp.507-511, 1998.
Processors in TCP in Notebooks and Sub-notebooks”, IEEE Transactions on
Components, Packaging and Manufacturing Technology, Part A, Vol. 19, No1,

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