結合標準CMOS製程技術與覆晶凸塊製作微機電探針卡之研究

Fabrication of MEMS probe card using standard CMOS technology with flip chip solder bumps

吳昌修(Chang-Hsiu Wu)

指導教授 ： 黃榮堂

國立臺北科技大學/機電學院/機電整合研究所/碩士(2008年)

摘要

本論文使用微機電製程(MEMS)搭配微電鑄(micro electroforming)技術製作垂直式彈簧探針，可應用在晶圓級探針卡。這種探針卡，主要包含一個CMOS晶片與一片印刷電路板，該CMOS晶片係使用標準CMOS-MEMS製程技術設計彈性探針結構，一體成型探針模組與空間轉換模組(space transformer)，該CMOS晶片可用於實施細節距的懸臂式探針卡，也可實施高密度垂直式陣列探針卡。該CMOS晶片利用CMOS製程既有的多層內連接金屬層增加佈線的方便性，進一步可納入線路補償的被動元件或訊號處理電路於佈局之中，增加測量訊號的頻寬與品質。結合微電鑄技術製作凸塊成為探針測試探頭，並經研磨製程提升共面度，藉由後製程蝕刻懸浮探針與對晶片背面穿孔填入導電材料成錫球後，即可與印刷電路板接合成一探針卡。

關鍵字

探針卡 ； CMOS製程 ； 微機電 ； 微電鑄 ； 鎳凸塊 ； 乾蝕刻

並列摘要

This thesis aims to combine MEMS process with micro electroforming technology to fabricate vertical spring-probe, which can be applied to wafer level probe card .This probe card includes a CMOS chip and a print circuit board. The said CMOS chip based on the standard CMOS-MEMS process is characterized by integrating a probe head with a space transformer. Because of having characteristic of fine pitch and high density, it could be served as a cantilever or a vertical probe card. The standard CMOS process provides multi-layer interconnections, which could assist the probe head in connecting with the external devices, giving the convenience in wiring layout. Furthermore, some passive components or signal-conditioning circuits are easily to be integrated into said CMOS chip to increase the frequency bandwidth and ensure better measuring quality. An array of bumps protruded as testing probes in said CMOS chip are fabricated with an electroforming process, and followed by a polishing process to improve their coplanarity. By several standard MEMS etching processes, the probes can be released and the back via-hole of said CMOS chip can be formed and filled with certain conductive material as solder balls. The final CMOS chip is prone to bond with the print circuit board into a probe card.

並列關鍵字

Probe Card ； CMOS Process ； MEMS ； Electroplating ； Nickel Bump ； Dry Etch

參考文獻

[9] K. F. Zimmemann, “SiProbe-a new technology for wafer probing”, International Test Conference IEEE, Washington, USA, 1995, pp.106-112.

[10] S. Sasho and T. Sakata, “Four multi probing test for 16 bit DAC with vertical contact probe card”, International Test Conference IEEE, Washington, USA, 1996, pp.86-91.

[11] M. Beiley, J. Leung, and S. S. Wong, “A micromachined array probe card-fabrication process,” IEEE Transaction on computer, packaging and manufacturing technology-Part B, vol.18, no.1, 1995, pp.179-183.

[12] M. Beiley, J. Leung, and S. S. Wong, “A micromachined array probe card-characterization,” IEEE Transaction on computer, packaging and manufacturing technology-Part B, vol.18, no.1, 1995, pp.184-191.

[14] Y. Zhang, Y. Zhang, and R. B. Marcus, “Thermally actuated microprobes for a new wafer probe card,” Journal of MEMS, vol. 8, no.1, 1999, pp. 43-49.