- 學位論文
應用奈米碳管束製備探針卡探針
Synthesis method of carbon nanotubes bundle probe on probe card
摘要
由於市場對電子產品的需求越來越多元化，所以電子產品的功能也逐趨複雜化，在電子元件功能多樣化的情況之下，積體電路晶片的體積卻不增反減，因為輕薄短小也是市場的主流。因此在傳統的積體電路元件中，產業界嘗試將所有積體電路元件持續微小化，但是限制在於無法讓積體電路元件上的圖形尺寸小於兩個原子的距離2.35A，故將傳統IC微小化以及薄型化之後，將其組裝堆疊起來，即為當今最熱門的3D IC。但由於間距過小，故在IC量測有了更進一步的需求。 本研究目的為研究市場上探針卡探針的微型化可能性，因此在眾多材料中，由於奈米碳管具備高的楊氏模數及較低廉的製造成本，所以希望使用奈米碳管束來當作探針卡的探針，並可用來測試三維立體結構的積體電路晶片。本研究的重點在於研究奈米碳管的成長方式，以及如何使奈米碳管的成長趨向穩定並長出準值的奈米碳管束，以符合作為探針的需求。 在研究中，奈米碳管束陣列圖形目標為小於直徑25μm，高度為200μm，並使用化學氣相沉積法成長出奈米碳管束，製作出探針卡探針。藉由利用奈米碳管束當作碳針的結構，再利用在碳管叢表面鍍金的方式來做為導電的依據，如此希望得到低阻值，高機械強度的奈米碳管碳針，並可用於大量生產，降低製造成本。
並列摘要
Since the demand of the electronic production, functional electronic device has become more complex, the volume has not increased with numerous integrated circuit on a chip, slim and light electronic products is popular in mainstream market. Hence in conventional electronic device, industrials attempt to decrease the size of the integrated circuit, but the physical limitation of the micro devices is the patterns which were designed for the device could not less than 2.35 angstrom between atoms. So wafer bonding after conventional IC miniaturization is the most popular topic in recent. Because of the narrowing pitch in 3D IC, a newly probing method is demand. The main research of this paper is to investigate the feasibility of the miniaturization conventional probe. Because of the excellent mechanical and inexpensive property, carbon nanotube (CNT) is becoming the popular material. The topic researching here is focusing on vertical aligned CNT growth for synthesis of a probe. The target to the size of the probe is less than 25μm in diameter, 200μm height, and chemical vapor deposition for CNT growth. Finally a low resistance with strong structure CNT in Au metal coated bundles are desired, and also for mass production and low cost manufacture.