- 學位論文
工具鋼與鎳之擴散接合研究
A Study on Diffusion Bonding of Tool Steel and Nickel
摘要
隨著光電ヽ生醫科技的進步，產品力求輕薄短小，因而衍生出「微系統技術」。其大量生產仍需靠塑膠射出成型來複製，微射出成形是生產複雜微小塑膠ヽ陶瓷零件最有效率的製造方法之一。 然而微模具在電鑄成形後需經增厚處理，因為增厚處理使非常薄的微模具(模仁)與模具基座較易配合，也將提供微模具於射出成形過程中之支撐，一般增厚製程會在微模具與增厚層間加入一緩衝層避免應力與表層變質造成之問題。如果直接將模具以硬銲方式接合於增厚材料，將會造成微模具軟化或內應力，導致微模具翹曲變形等問題，而現階段產業界採用的外圍銲接增厚、真空吸附、磁性吸附等方式也都各有限制。 本研究利用濺鍍與電弧離子鍍製程來設計Ag/In暫態液相擴散過程，先使熔點低的銦熔融，並與銀互相擴散接合產生介金屬化合相，進而使接合處熔點提高，並且加以比較。利用SEM與OM觀察結構，XRD及EPMA定性定量分析。研究發現電弧離子鍍製程接合效果比直流濺鍍製程接合的抗拉強度高，且離子鍍層在時效48hr後，有均質化效果並且產生Ag3In相與InNi相，其相可以耐高溫。利用此製程接合電鑄鎳片與工具鋼，可達到低溫(230℃)快速接合，高溫環境工作應用。
並列摘要
With the progress of electro-optical technology and biotechnology, micro-system technique has been developed for the production and the mass production can be achieved by injection modeling. One of the effective methods to manufacture plastic and ceramic parts is micro injection modeling. The micro mold after forming of electroform needs the increasing thickness process which inset in the block and supports the micro mold during the injection modeling. Otherwise, the buffer layers could prevent the problems of stresss and surface deterioration. However, the molds are brazed with increasing thickness materials by brazing of micro mold, it will lead the micro mold to be soft and rised internal stress. In this study, direct current (DC) sputtering and arc ion plating (AIP) were used to design the process of Ag/In transit liquid phase diffusion bonding. At first, the intermetallic phase was produced by the diffusion with low-melt point indium and silver. The melting point and strength of the bonding area will be enhanced. The structures were observed using SEM and OM, XRD and EPMA were used to identify the quality and quantification, respectively. The arc ion plating layers treated by 48 hours treatment could produce the Ag3In phase and InNi phase used for high temperature environment effectively and the structure of the layers is more homogenous. Hence, the micro mold after increasing thickness process is applied on a high temperature environment using the transient liquid phase diffusion bonding the tool steels and electroformed nickel plates at low temperature of 230℃.