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  • 學位論文

薄型均熱板氣室高度與微結構改質影響之研究

Study on the Performance of Thin Vapor Chamber in Different Vapor Flow Space and Wick Modification

指導教授 : 蘇程裕

摘要


3C產品為吸引消費者目光,皆朝向輕薄短小設計,電子散熱裝置也在此趨勢下受到嚴峻的挑戰,均熱板為一種以熱管為理論基礎的兩相變化熱傳冷卻系統,二相熱傳元件為一真空腔體內襯微結構於內壁上,利用腔體內部流體的蒸發凝結進行快速熱傳遞。本研究擬利用此熱傳原理製造一薄型均熱板,藉由不同氣室高度的薄型均熱板效能檢測與腔體內部微結構的批覆改質、蝕刻技術、複合式微結構的導入應用,來探討對性能之影響。藉由對相同厚度且無進行改質的薄型均熱板與銅塊進行效能量測來互相比對,探討薄型均熱板氣室高度與微結構改質所造成的影響。 本研究中使用不同沖模治具所沖壓之銅板材,以擴散接合方式製造不同氣室高度薄型均熱板並複合搭配燒結柱支撐使用,再以薄型均熱板總厚度0.8mm為基礎下,來進行腔體內部微結構改質包含DLC鍍層披覆、蝕刻技術的導入應用,並藉由與同厚度的銅塊及微結構未改質的0.8mm薄型均熱板來進行效能檢測比對,獲得重要的薄型均熱板製造資訊。

並列摘要


3C products have been designed toward thinner and tiny scale as a result of attracting more attention of consumers. Thus, the improved efficiency of heat dissipation for electronic devices is a difficult challenge. Vapor chamber is one kind of cooling system using theory of changed thermal conductivity from two-phase, which is based on heat pipe. This two-phase component consists of a wick structure which is inside the vacuum chamber wall; using the working fluid evaporation and condensation characteristic to speed up the thermal transmission. In this study, we fabricate the thin vapor chambers using above mentioned heat transfer theory. Meanwhile, we investigate the influence of varied heights of vapor flow space and wick structure‘s modification on the performance of thin vapor chambers. For this research, the copper sheets-made thin vapor chambers with various vapor flow spaces were fabricated via diffusion bonding technique. In this process, the copper sheets were prepared by different punching fixture. The sintered copper columns were fabricated to sustain spaces in vapor chambers. We modified the inner wick structure including DLC film coating, applied etching technology with a fixed thickness of 0.8 mm for all specimens. We also compared the performance of thin vapor chamber with that of copper ingot and non-modified thin vapor chambers in order to survey the essential manufacturing information for future application.

參考文獻


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