由於閥元件循環接觸易造成表面耗損,影響其操作壽命,進而導致洩漏狀況發生,因此藉由類鑽碳薄膜具備抗磨耗、低摩擦係數等特性,探討應用於閥元件表面接觸之可行性,為本研究主題。其研究內容,一方面透過專利檢索模式,彙整成長類鑽碳薄膜於閥密封元件表面之相關專利,經研讀及分類後製作專利管理地圖與技術地圖,進而分析其技術應用趨勢,另一方面由專利資料中挑選類鑽碳膜應用之接觸分析類型,依據奈米壓痕量測數據計算出類鑽碳薄膜之機械性質,轉換為薄膜結構有限元素分析參數,分析薄膜與基材應力分佈情形,以探討薄膜結構應用特性。 由專利分析結果發現,類鑽碳膜應用於閥元件之類型包括生醫用閥、動力用閥、衛浴用閥、工業用閥及電磁閥等;而經由非平衡磁控濺鍍系統所沉積厚度1.5 mm之Zr-DLC膜,表面粗度可達Ra 4.1 nm,硬度至11.7 GPa,並透過有限元素分析發現不僅薄膜接觸應力與基材楊氏模數有關,薄膜硬度亦受到影響。
Surface damages of valve components are always caused by frequent impacts and they are also an important factor to reduce the product life of valves. This studying introduces the diamond-like carbon films with great wear resistance and low friction coefficient to protect the surface of valves. We developed two methodologies in this study. The first methodology applied patent search method to collect the patent information related of the diamond-like carbon deposited on surface of valves. Those collected information will be studied for creating a patent management map and technical map. By observing and analyzing the maps, we can obtain the technical application tendency. The second methodology is to pick one of contact analysis of valves from patent information. Based upon the nanoindentation measurement, the mechanical properties of diamond-like carbon films can be obtained. Those properties will be transferred to the parameters for running finite element method. The distributed stresses of thin films and substrate material calculated by finite element method are studied to find the characteristics of thin films on the structural application. From the results of patent analysis, we found that the valves with diamond-like carbon films are usually applied as biomedical valves, power valves, shower valves, industrial valves and solenoid valves. We applied the Finite Element Method to analyze the sample which was coated Zr-DLC in the thickness 1.5mm, the surface roughness Ra 4.1 nm and the hardness 11.7 GPa by closed field unbalanced magnetron sputter ion plating (CFUBMSIP) Process. The results show that the mechanical properties of substrate affect the contact stress and the hardness of thin films.