陶瓷雷射熔結法成型機改善及製程優化

本研究的目的為重新設計或部分修改舊有快速原型機的組件來消除舊有機構對製程所產生的不良問題，將原本過久的製程時間縮短，並使機器的整體精度提高，建構0.05mm的層厚的鋪層及雷射掃瞄的技術。本文第一部分為改良鋪料裝置、安全裝置、清料裝置及加熱裝置，改良了舊有機構所產生不利於製程的問題，並且加裝了平面標準機構，建立了底板平台與XY-plotter平行度的量測方法…等。第二部分利用改善後的機構、改變機構運作的方式及乾燥方式的變化，使得製作工件的時間縮短，達到製程優化的目的。陶瓷雷射熔結法(Ceramic Laser Fusion, CLF)成型機經過改良後，疊層厚度已從0.1mm縮小到0.05mm，且機器的Z軸精度，每層皆可控制在0.01mm以內。當雷射功率為30W時，速度在200mm/s時生坯上下層可以黏結不致於破裂或分開。此外，清料除了使用超音波和氫氧化鈉溶液外，也可直接用水輕輕沖洗，藉以加速清除未掃描之生坯。最後，本研究證實CLF成型機已具有製作高複雜度陶瓷工件的能力。

關鍵字

陶瓷雷射熔結法；鋪層厚度；陶瓷工件

並列摘要

The aim of current study is to redesign or modify some components to eliminate the problems caused by original mechanisms, shorten the time consumption of the process, improve the precision of machine, build a layer with 0.05mm thickness and construct technique of laser scanning. The first part of this paper includes the improvements of paving device, safety device, cleaning device and drying device. The old mechanisms which are unfavorable to the process have been modified. Besides, a level measurement mechanism is installed to establish a method which ensures the parallel between working plate and scanning plane built by X-Y plotter. The second part is to shorten the time-taken for fabricating the work piece by improved mechanism to achieve the aim of optimization. The modified apparatus for Ceramic Laser Fusion is capable for layer thickness reducing from 0.1mm to 0.05mm. The accuracy of Z axis can be controlled within 0.01mm. The layers can be bound without cracks under the laser power 30W and scanning speed 200mm/s. Furthermore, the green portion not only can be removed by ultrasonic machine with NaOH solution but also can be removed by flushing water. Finally, the CLF rapid prototyping machine is capable to make complex ceramic work piece.