導熱性與熱阻測量技術之研究

為解決電子元件之發熱密度、發熱量快速增加與延長使用壽命，須仰賴優異之熱管理，而要達成此目標則需經過精準之熱性質測量。隨著產品輕薄短小化之設計、新材料之開發與運用，使得電子元件材料之熱力性質測量越來越困難，當樣品之尺寸越輕薄短小，其在測量時越容易產生誤差，這些誤差通常會使得熱管理上產生些許變數。因此除了擁有一套高可靠度與重複性佳之熱性質測量系統外，還須針對不同樣品設計出適合的測試方法與測試條件，而本研究主要是對導熱性與熱阻作研究，其中也運用一種平板式之導熱性測試，配合COSMOSFloWorks模擬分析，專為測試薄板材料之導熱性。導熱性實驗上測試了銅、發泡碳與銲料之導熱性，實驗結果顯示可以精確測得厚板材料之導熱性。平板式導熱性分別測試了銅板與銲料，利用COSMOSFloWorks模擬分析後，發現實驗與模擬之數據誤差在0.6OC以內。熱阻實驗分別測試了銅鰭片、鋁鰭片、發泡碳鰭片以及利用銲料接合銅基底與發泡碳鰭片，實驗結果顯示發泡碳鰭片於自然對流之情況下，其熱阻較鋁、銅鰭片低。

關鍵字

導熱性；熱阻

並列摘要

In order to solve the high power density and power generation of modern electronics, and extend the service lifetime, an excellent thermal management is necessary. The goal can be achieved only through the precision measurement of thermal properties. While products become lighter, thinner, shorter and smaller, it is more and more difficult to measure the thermal properties of components. For samples of this kind, temperature measurement error is always on the same order of temperature difference we want to measure. Consequently, a set of high reliance and precision thermal measuring system is designed to test various samples. This researches focus on the techniques of measurement for thermal conductivity and thermal resistance. Besides, with compliant with numerical simulation, the thermal conductivity of thin sample is also measurable. The conductivities of copper, foam carbon and solder are measured, and the results show good precision while measuring thick samples. Thin copper and solder samples are also tested. By using the numerical simulation of COSMOSFloWorks, it is found the experiments and numerical simulation data is very close, within 0.6OC. Experiments for the thermal resistance of copper, aluminum, and foam carbon heat sink with solder joint copper basis, and foam carbon heat sink are also performed. The nature convection experiments data show that the thermal resistance of carbon foam is better than aluminum and cooper heat sinks.

並列關鍵字

Thermal Conductivity ； Thermal Resistance

參考文獻

[6]M. Michael Yovanovich, “Four decades of research on thermal contact, gap, and joint resistance in microelectronics,” IEEE Transaction on Component and Packaging Technologies, vol.28, no.2, June 2005, pp 182-206.

[8]M. M. Yovanovich, “Investigation on the effect of metallic foils upon thermal joint resistance: evidence of optimum foil thickness,” Proc.AIAA 7th Thermophysics Conf., San Antonio, TX, Apr.10-12, 1973.

[9]K. C. Chung and J. W. Sheffield, “Enhancement of thermal conductance of coated junction,” Journal of Thermophysics and Heat Transfer, vol. 9, no. 2, pp. 329-334.

[10]Jie Wei, “Measurement of vapor chamber performance,” 19th IEEE SEMI-THERM Symposium, 2003, pp. 191-194.

[11]Michael D. Haskell, “Thermal resistance comparison of graphite foam, aluminum and copper heat sink,” Electronics Cooling, 2006.

國際替代計量

導熱性與熱阻測量技術之研究

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