CMOS-MEMS 製程是直接從一般IC 製造中的CMOS 製程加上微加工技術,使其具有機械特性,因此利用CMOS-MEMS 製程來製作微機電元件,不僅可以有一般微機電加工技術的優點,同時也因為可與一般IC 製程相容,易於與IC電路整合,形成微機電系統。本論文是利用CMOS 標準製程與微機電後製程研製電容式指向性微麥克風陣列,提出一種設計可以將兩種不同的麥克風結構做在同一晶片上;並設計一種製程方法可同時將兩種不同結構的麥克風製作完成,且可與CMOS 電路整合為晶片;同時藉由CoventorWare 模擬分析軟體針對微麥克風結構做改良設計;再利用CIC 所提供的RLS 後製程以及乾、溼蝕刻製程步驟達到指向性麥克風陣列結構的建立,最後利用覆晶封裝技術使得指向性麥克風性質可以更加良好。
CMOS-MEMS process is directly from the general IC manufacturing in the CMOS process with micro-processing technology, it has the mechanical properties, thus using CMOS-MEMS process to fabricate MEMS components, not only has a general MEMS processing technology advantages, while because with normal IC fabrication compatible, easy integration with IC circuitry to form micro-electromechanical systems The study is the use of standard CMOS processes and MEMS capacitor fabricated after the point of micro-microphone array. Besides, propose a fabrication method of directional microphone array can be produced, and with CMOS processes and circuits integrated into the chip. At the same time by computer simulation analysis software to do for the improvement of structural design of micro microphone; Finally, RLS provided by CIC after the process and the dry and wet etching steps to the microphone array structure of the establishment.