感光性樹脂在高透明聚亞醯胺基材上之接著強度及其性質研究

The Study of Photosensitive Resin on the Transparent Polyimide Substrate

劉佩青(Pei-Ching Liu)

指導教授 ： 張淑美

國立臺北科技大學/工程學院/有機高分子研究所/碩士(2010年)

https://doi.org/10.6841/NTUT.2010.00306

摘要

本研究是將感光性樹脂組成物應用於高透明聚亞醯胺薄膜基材上，利用紫外光照射使感光性樹脂組成物於基材上能達到較佳的接著性，採用100%環狀脂肪族環氧樹脂（E3）與部份環狀脂肪族環氧樹脂（E3）混合不同比例官能基數(2個（E1及E2）、4個（E5）或8個環氧基（E4）)之環氧樹脂來進行研究，其比例分別為80%：20%或65%：35%，其中環氧樹脂的結構是以新型形態的芴基或是含雙酚基等為主。利用矽烷偶合劑或改變高透明聚亞醯胺薄膜基材表面能，使基材界面與感光性樹脂組成物產生結合作用，以及加入含有二元醇(Tri (propylene glycol)：TPPG)成分來提高反應速率，並改善接著強度。利用熱機械分析儀(TMA)、熱重量分析儀(TGA)、及示差掃瞄熱分析儀(DSC)等儀器，分析感光性樹脂組成物之性質。結果顯示，在接著強度方面，含有芴基結構的感光性樹脂組成物(E3E5-80/20)，經紫外光照射後，再進行加熱試驗，有助於提升感光性樹脂與基材間的接著強度，其最大接著值為0.286kgf/mm2 (以ASTM D903剝離接著測試方法)，可有效增進與基材的接著性。在熱分析方面，由TMA、TGA及DSC結果得知，E3E5感光性樹脂組成物，不因比例差異而在Tg及熱裂解溫度上出現太大的變異。另外加入過量之TPPG單體，會降低Tg及接著強度，其可能是因過量的TPPG單體未能在有效時間內參與反應，以致影響感光性樹脂組成物最終物性。

關鍵字

紫外光硬化 ； 聚亞醯胺 ； 環氧樹脂 ； 陽離子光起始劑

並列摘要

The purpose of this study is to apply photosensitive resin on high transparent polyimide substrate. We applied the UV Radiation the substrate so that to acquire better adhesion between photosensitive resin and substrate. Therefore, using 100% cycloaliphatic epoxide to compare with partial cycloaliphatic epoxide with various mix-ratio of different functional groups (two, four, or eight epoxy groups) to do research. The percentage of partial cycloaliphatic epoxide and the epoxy resin with bisphenolyl and fluorenyl moieties is 80%:20% and 65%:35%, respectively. We used silane coupling agent or change the surface energy of high transparent polyimide substrate to make the substrate and photosensitive resin combine together. Moreover, we also try to add TPPG to improve adhesion and reactivity. By using the TMA, TGA and DSC, we could analyze the characteristic of photosensitive resin. For adhesion strength part, the results showed that by using the photosensitive resin contained the fluorine-based structure (E3E5-80/20) to proceed UV light radiation and thermal processes and result in promoting the adhesion strength between photosensitive resin and substrate with the maximum adhesion strength of 0.286 kgf/mm2. Therefore, the photosensitive resin contained the fluorine-based structure could promote the adhesion to the substrate well. For thermal analysis part, the results from TMA, TGA, and DSC showed that the various ratio E3E5 photosensitive resins composite doesn’t show the great difference on Tg and thermal decomposition temperature. Besides, adding excess TPPG lowers Tg and adhesion strength because the excess TPPG doesn’t react completely.

並列關鍵字

UV curing ； Polyimide ； Epoxy Resin ； Photoinitiator

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