添加氮化硼複合粉體對高密度聚乙烯導熱影響之研究

The Effect on Thermal Conductivity of HDPE Filled Boron Nitride Composites Fillers

顏楷哲(Kai-Jhe Yan)

指導教授 ： 蘇程裕

國立臺北科技大學/機電學院/製造科技研究所/碩士(2012年)

摘要

因應目前電子產品的微小化，電子產品壽命受限於散熱效率，而高導熱複合材料中，無機材料通常具備有較高的熱傳導性質。其中氮化硼粉末之熱傳導係數比一般陶瓷粉末(例如：氧化鋁、氮化鋁、氧化矽)高，且具備良好的電絕緣性與化學穩定性，而且氮化硼是應用於各種高導熱複合材料的填充物之一。
本研究係分別使用不同粒徑製備大單晶氮化硼/小單晶氮化硼/SMPL-X與氮化硼/氧化鋁複合粉末，並製作成片狀和球狀形態總計四種粉體做為高分子聚合物之填充材料，並且將複合粉體披覆PMMA，改質披覆量最佳為粉重的8%重量，再以高密度聚乙烯( HDPE )為高分子基材，使用高分子混煉技術，將基材與氮化硼複合粉末利用塑譜儀( Brabender )使高分子在熔融狀態下進行均勻混煉，製成HDPE/導熱粉體母粒，後續以熱壓與射出成型製得導熱複合材料。
研究結果顯示，經球形化之複合粉體可以提升高密度聚乙烯中無機材料的添加比例，並改善氮化硼單一方向性熱傳導之缺點，使熱傳為多方向性增加熱傳導效率；相同固含量下球形化可以降低原始材料之介電係數；因高固含量下塑膠可塑性變差，但球形化粉體可以改善此現象。

關鍵字

高密度聚乙烯 ； 陶瓷複合粉體 ； 氮化硼 ； 氧化鋁 ； 雲母 ； 熱傳導性

並列摘要

In order to respond the fact that miniaturization of microelectronic and electronic product life (reliability) is limited by the thermal conductive efficiency. In the high thermal conductive composite materials, inorganic fillers such as alumina, aluminum nitride, silicon oxide and boron nitride have higher thermal conductivity. Among these fillers, the thermal conductivity of boron nitride powder is much better than the others. Relying on its good electrical insulating properties and chemical stability, boron nitride is one of the fillers applied in various composite materials of high thermal conductivity
In this study, these composite powders like h-BN/SMPL-X and h-BN/Al2O3 were synthesized. Those spherical and platelet composite powders as the filler, and covered in PMMA at the same time. The optimum surface treatment is 8 wt% of composite powders. Subsequently, the High-density polyethylene (HDPE) was used as the polymer matrix. In polymer mixing technique, the substrates and composite powders were mixed homogeneously at melting state using plastic spectrometer to prepare HDPE/thermal conductive composites. Finally, the thermal conductive composite ingots were fabricated using hot press and injection of HDPE/thermal conductive composite powders.
The results show that spherical composite powders could enhance the ratio of inorganic materials doped in high-density polyethylene to improve the shortcoming of single-directional thermal conductivity in boron nitride, increasing the thermal conductive efficiency. Under the same content, the dielectric constant of spherical powders was reduced compared with original material. The result could be attributed to the improvement of plastic’s drawability by spherical powders.

並列關鍵字

High-Density Polyethylene ； Ceramic composites powder ； Boron Nitride ； Aluminum ； Mica ； Thermal Conductivity

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