本論文主要是探討同軸纜線至微帶線垂直轉接的傳輸特性,並提出一個新型的SMA接頭設計,主要目的為改善該垂直轉接的高頻響應,以增加其1-dB通帶頻寬。傳統SMA接頭至微帶線垂直轉接的1-dB通帶頻寬僅有16.3 GHz,本論文所提出之設計是在傳統SMA接頭上加裝一金屬套環,並搭配基板上的偏心圓穿孔,以降低同軸接頭與微帶線在垂直轉接處因電磁場型變化所產生的損耗。本論文採用以有限元素分析法為基礎的模擬軟體HFSS進行模擬分析,並藉由實際量測來驗證所提出之同軸纜線至微帶線垂直轉接的方法具可用性。 本論文同時對所提出的垂直轉接方法作完整的特性評估,探討製造及裝配過程中可能產生的誤差對轉接效率的影響,並提出方法加以改善。另外,本論文並加以討論不同的微帶線基板材質與同軸接頭對於研究所提出之垂直轉接的可用性。上述特性證實本論文所提出之同軸纜線至微帶線垂直轉接方法的廣泛適用性。
The thesis is mainly to discuss the transmission characteristics of coaxial-to-microstrip vertical transitions, and to propose a new SMA connector. The main purpose is to improve the high-frequency characteristics of coaxial-to-misrostrip vertical transitions, and increase its 1-dB passband. The 1-dB passband of traditional coaxial-to-microstrip vertical transitions is only 16.4 GHz. The purpose of designing the thesis is that assembling a metallic ring in the traditional SMA connector with an eccentric perforation on the substrate. It reduces the losses of the electromagnetic field changed between coaxial line and microstip line. The thesis uses the simulation tools, HFSS, which is based on the finite element method, and verifies the design by measurement results. The thesis also estimates the transmission characteristics of the proposed vertical transitions, discussing errors of fabricate and combination, and proposes the solutions to improve the errors. Moreover, the thesis discusses the vertical transitions by different substrates and coaxial connectors. The above characteristics confirm the extensive applicability of the proposed coaxial-to-microstrip vertical transitions.