- 學位論文
積體電路封裝銅打線製程成本效益分析
The Cost-Benefit Analysis of Copper Wire Bonding Process in IC Package
摘要
科技產業不斷進步，科技產品也日新月異，消費者對電子產品的要 求也越來越高，為了滿足消費者的需求，晶片設計廠商發展更多功 能強大、電源消耗越小、晶片及封裝面積越來越小，朝向輕薄短小 的產品設計。廠商採用先進的製程、替代性的材料，更要在價格上 具有相對競力，為了讓產品及價格更具市場競爭力，讓該產品可以 有更多的功能外並且有一定的可靠度品質。近年來金價飆漲，導致 封裝成本增加，封裝產業漸漸導入銅線取代原有金線做為積體電路 封裝與外部信號連接傳輸材料，銅線的材料成本遠低於金線成本， 若將打線材料由金線改為銅線，一般可降低封裝成本10~30%，可 是效益會因不同的產品應用、封裝元件、不同的生產條件而異，只考 慮到材料成本是不夠的，還需考慮到其他的構面，因為不同的構面 ，帶來的效益也不盡相同。 本研究針對評估導入銅打線帶來的效益，分兩個層面探討，分別是 品質鑑定層面與製程層面之成本效益。分析不同的構面包含設備投 資成本、材料成本、製造成本、可靠度測試成本提供給導入廠商 參考。對於製程方面，發現除銅線製程時間較長、生產管制需更嚴 謹外，良率與品質與金線是相當的，在可靠度測試上經環境壓力測 試後，其與金線的表現是一致的，亦即銅打線是可以成功取代既有 之金打線。成本效益分析，經由淨現值法、效益成本比法、內部報 酬率法進行分析，結果顯示皆可為企業帶來效益，透過敏感度分析， 當封裝腳數增加同時打線數量增加時，轉換銅打線成本效益愈大， 代表整個高腳數銅打線封裝投資建置計劃是具體可行的。
並列摘要
As technology continues to progress and products revolutionize, the requirements to consuming electronic products also increase. In order to meet consumer demand, chip design companies toward a more powerful, less power consumption, smaller chip and packaging size product design. Manufacturers adopt advanced process and alternative materials to be more competitive with respect to pricing, quality and reliability. In recent years, the increase of gold price have significantly increased the cost of semiconductor packaging. Assembly houses intend to replace gold wire with copper wire for the connection of integrated circuits to the packaging materials. In general, it is expect to reduce the packaging costs by 10% to 30% if copper wire is implemented. However, the actual benefits will vary depending on the applications, the package type and the production environment. Only taking into account the cost of materials is not enough, need to take into account other facet, because of the different facets benefits are not the same. This study explores the benefits of implementing copper wire process from aspects of both quality appraisal cost and process cost. We consider equipment costs, material costs, manufacturing costs, reliability testing costs, etc. Regarding to the copper wire bonding process, the process cycle time is longer, requiring more strict production control, while the process yield and quality are comparable to gold wire bonding. Results of reliability testing indicates that the performance of copper wire and gold wire are similar, i.e. the copper wire may successfully replaced the gold wire. Cost-benefit comparisons are done based on the analysis through net present value, benefit-cost ratio, internal rate of return. The results show that the implementation of copper wire bonding can bring benefits for the enterprise. Finally, results of sensitivity analysis indicate that the cost performance of copper wire bonding is more significant as package pin count increases. This means that the copper wire bonding is more beneficial to the higher function semiconductor packaging industry.