The product’s uneven thickness is often prone to warpage, uneven shrinkage. The examination solved the uneven thickness of steady of cellphone display stand by bi-injection molding. Mouldflow software Moldex 3D and Taguchi method was used to find the molding condition which has lower warpage. At first, the examination chose eight control factors include mold temperature, melting temperature, injection pressure value, injection time, packing pressure value, packing during time, cooling time and coolant temperature. Then examination found that melting temperature, packing pressure value, cooling time and coolant temperature have most influential for warping, so research chose those control factors to do further optimization experiments. The warpage had great improvement under optimized process condition through mouldflow.