摘要
影音產品隨著畫質的提升，晶片效能亦須提高，但也伴隨著溫度急遽上升，加大散熱器雖然可以解決過熱問題，然而重量增加後，造成介面卡的固定閂(Latch)因回彈力(spring back force)不足而鬆脫，以及使用者過度推壓固定閂造成變形(deformation)。本研究探討固定閂在不同的位移(displacement)下，所產生的回彈力與變形。使用的材料為聚醯胺(PA66)，玻纖含量分別為0%、 5%、15%、30%、45%。首先依據ASTM 638-03規範製作標準拉伸試片，並經由拉伸試驗測試楊氏係數(Young's modulus)、降服強度(yielding strength)、抗拉強度等性質。將拉伸試驗所得到的數據，匯入ANSYS軟體作模擬分析，不同的位移狀態下的應力-應變圖(stress-strain diagram)，以及回彈力與變形之關係。最後，進行模具開發與固定閂試片射出成形，然後使用自動插拔力試驗機(auto insert-extract force test machine)作回彈力與變形測試，實驗的結果與ANSYS模擬分析結果進行比較。 結果顯示，玻纖含量越高，則固定閂之回彈力越大。但玻纖含量在低於15%時，且在小位移量1 mm時，對於改善回彈力並無幫助。另外當位移量達到2 mm以上時，聚醯胺(PA66)已經達到降服，固定閂開始產生變形。
並列摘要
With the continually improving picture quality for AV products, the usefulness of chipset is greater but accompanied with thermal issues. Overheat can be solved by expanded radiator. However, increasing the weight causes the Latch behind the Graphics Cards to loosen due to the lacking spring back force, and the deformation of Latch because of the user’s over pushing the Latch. This research focuses upon spring back force and deformation of Latch that result from various displacements. Experimental material of polyamide (PA66) was used including the glass fiber (GF) of 0%, 5%, 15%, 30%, and 45%, respectively. First, the tensile test sample was made by using the ASTM 638-03. The Young's modulus, the yielding strength, and the tensile strength obtained through the tensile experimental test. Next, these tensile test data were imported the ANSYS software for simulating the dynamic analysis of stress-strain diagram and the relationship between the spring back force and displacement. Finally, the Latch sample of mold was made and injected the specimens. The spring back force and deformation of the Latch was tested by using the auto insert-extract force test machine. These experimental data were compared with the results of ANSYS simulation. Results show the higher contain of the GF, the larger spring back force of the Latch. However, it is useless for improving the spring back force when the GF is below 15% and the displacement is less than 1 mm. Furthermore, the Latch of PA66 has been to its yielding point and caused the deformation when the displacement is reached to 2 mm.