透過您的圖書館登入
IP:3.19.244.187
  • 學位論文

整合性接取設備之硬體製作與測試

IAD Hardware Implementation and Test

指導教授 : 孫卓勳

摘要


並列摘要


This thesis will focus on the hardware research and test of Integrated Access Device (IAD) products, and is divided into two main parts: Very High Speed Digital Subscriber Line 2 (VDSL2) Bonding and Voice over Internet Protocol (VoIP), with theories and practical implementation. DSL – implemented with VDSL2 Bonding technology and has the fastest transfer rate over the traditional telephone line; VoIP – connect the existing telephone with two designed Foreign eXchange Station (FXS), and the VoIP can be obtain by direct dialing on the modified phone. Lastly, the IAD system was physically implemented. Testing was done to the two parts mentioned above, and the performance of the system was discussed and analyzed. The results show that with VDSL2 Bonding, the upstream and downstream transmission rate has doubled the capacity. With the bandwidth is sufficient for the normal home requirement of digital voice, video and data usage. As for the VoIP, the FXS interface provided by the IAD with the connection to the existing phone, allows the benefit of phone bill saving by using VoIP, without the need to buy an extra IP phone.

並列關鍵字

IAD VDSL2 Bonding VoIP FXS

參考文獻


[1] ITU-T, “Very high speed gigital subscriber line transceivers 2 (VDSL2),” ITU-T Recommendation G.993.2, Feb. 2006.
[2] K. Zhang, Y. Chen, N. Liu, and J Zeng, “Design of a Network-Processor-Based Intelligent Secure IAD,” in Proc. International Conference on Information and Automation, Zhangjiajie, Jun. 2008, pp. 739-742.
[6] W. Afric, N. Matosic, and R. Svalina, “Voice over Digital Subscriber Line Application in Croatian Network,” in Proc. 47th International Symposlum ELMAR-2005, Zadar, Jun. 2005, pp. 171-174.
[7] A. Azzam and M. N. Ransom, Broadband Access technologies, McGraw-Hill, New York, pp. 123-150, Jun. 1999.
[8] K. J. Kerpez and R. Kinney, “Integrated DSL Test, Analysis, and Operations,” IEEE Transactions on Instrumentation and Measurement, vol. 57, no.4, pp. 770-780, Apr. 2008.

延伸閱讀