覆晶技術應用於新型智慧型探針卡之探針組裝

隨著電子IC產業的迅速發展，半導體製程縮小且要求越來越嚴苛，元件良率變成是各公司的主要課題，而探針卡是一種快速檢測且有效確保良率的工具，目前探針卡的成本居高不下且產量不多，因此如何有效的降低成本及大量生產是許多探針卡公司的重要課題，考慮高頻時所產生的寄生效應與高頻的反射現象，必須準確的製作探針形狀以符合各頻的探測。本論文提出一概念，以微機電製程來提升探針之高頻特性，為改善其結構特性，將矽基板改用為傳輸特性優異的玻璃（Glass）為基板，並與Through Glass Via（TGV）技術與重分佈層（Re-distribution Layer，RDL）結合將線路設計於結構背面，利用電鍍銅導柱與背面其他電路元件連接做訊號的處理，且隨著探針的縮小，已無法使用一般的方法連接探針，因此我們以電鍍的方式製作錫球並迴銲，再利用覆晶封裝技術來達成目的。

關鍵字

探針卡；覆晶組裝；銅導柱；微電鑄

並列摘要

Semiconductor manufacturing process reduced and require more stringent. Yield of components is very important to each company, and probe card is a fast detection and effective tool to ensure yield. Currently, high cost of probe card and production is not more, so how to effectively reduce the cost and mass production is an important issue in many of probe card companies. Considering the high frequency generated by the parasitic effects and high frequency reflections, the shape of probe must be accurately to match the frequency of each detection. This paper presents a concept for MEMS process of probes to improve high-frequency characteristics. In order to improve its structural properties, we change silicon substrate to glass because of excellent transmission characteristics, and we combined Redistribution Layer (RDL) with the circuit design on the back of the structure. By plating copper pillar and back do deal with other circuit elements connected to the signal. Because the probe is shrinking, it can’t use normal method to connect probes. We plate and solder balls, and use flip-chip packaging technology to achieve assembling.

並列關鍵字

Probe Card ； Flip Chip Assemble ； Copper Pillar ； Micro-Electroplating

參考文獻

[1] C. S. Chang, A. Oscilowski, and R. C. Bracken, “Future Challenges in Electronics Packaging”, Circuits & Devices, pp.45~54, 1998.

[10] P. A. Totta and R. P. Sopher, “SLT Device Metallurgy and its Monolithic Extension”, IBM J. Research Devel., pp.226~237, 1969.

[11] P. Elenius, “Flex on Cap-Solder Paste Bumping”, 3rd International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, 1997.

[12] T. D. Dudderar, et al., “AT&T Surface uMount Assembly: A New Technology for the Large Volume Fabrication of Cost Effective Flip Chip MCMs”, International Journal of Microcircuits and Electronic Packaging, Vol. 17, No. 4, pp.361~368, 1994.

[14] T. Ogashiwa, et al., “Direct Solder Formation Technique on Al Pad and Its High Reliability”, JJAP, Part 1, Vol.31, No. 3, pp.761~767, 1992.

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覆晶技術應用於新型智慧型探針卡之探針組裝

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