熱管與散熱鰭片之精細機構微熱流研究

Fine-Structural Investigation of Heat Transfer for Combination of Heat Pipe and Cooling Plates

陳宏明(Hong-Ming Chen)

指導教授 ： 丁振卿

國立臺北科技大學/機電學院/製造科技研究所/碩士(2007年)

https://doi.org/10.6841/NTUT.2007.00447

摘要

本論文以熱管搭配散熱鰭片之CPU散熱器為研究對象，對散熱器機構加以剖析逐項研究，主要進行散熱器之熱管與散熱鰭片間的微熱流觀測與分析，內容包含熱管的熱傳導行為、熱管到散熱鰭片的熱傳導、散熱鰭片間的流體流動現象等。本研究工作所需的裝置及量測儀器均以自行架設或製作為主，依造ASTM標準架設與製作，已完成CPU熱源模擬器製作、及CPU散熱器之熱阻量測裝置架設，所架設之熱阻量測儀器完全符合ASTM標準，可對一般CPU進行熱阻與效率量測。另外，本研究工作還以紅外線熱像儀及彩色Schlieren等光學技術對熱管及散熱鰭片間的熱傳行為進行定量與定性分析，在彩色Schlieren技術方面，已成功的以水為介質觀測並比較熱管與銅管的熱傳導行為，由於熱管的熱傳導行為主要是利用管中液體因瞬間吸熱而汽化，在由管內壁的微結構產生凝結而放熱，此機構造成熱管的熱傳導速率甚大於銅管，但也因熱管的特殊技術，使得熱管的熱傳行為與傳統材料之熱傳行為大大不同，傳統材料的熱傳導行為自熱源逐步傳向遠端的熱傳導行為，在熱管則相反，在本研究工作的彩色Schlieren觀測中，熱管的管壁熱流最早自熱源的最遠處冒出，此結果與銅管的自熱源最近端冒出明顯不同卻也完全符合理論預期。但是當熱管搭配不同數量的散熱鰭片時，其熱傳導行為除了比銅管更大的熱傳導速率外，與銅管搭配散熱鰭片雷同，最靠近熱源的散熱鰭片最先被觀測到熱流的產生，此結果說明了為何以熱管搭配散熱鰭片所製作的CPU散熱器，在遠離熱源端的溫度較低的原因。本研究工作的所有量測均同步搭配紅外線熱像儀進行定量的比較分析。

關鍵字

CPU散熱器 ； 熱管 ； 散熱鰭片 ； 熱阻量測儀 ； 紅外線熱像儀 ； 彩色Schlieren

並列摘要

The study focuses on the CPU cooler with the combination of heat pipe and cooling plates, which has structural investigations for the CPU cooler. The main peformance is the measurements and analyses of micro-heat flow between heat pipe and cooling plates including characterization of the heat pipe's heat transfer, heat transfer from the heat pipe to the cooling plates, flow phenomena between the cooling plates, and so on. The applied equipments and instruments are homemade principally based on the ASTM standard. The until now accomplished equipment are the CPU simulator and the thermal resistance measuring instrument, which can also be used to measure the general CPU cooler. Moreover, the research uses also the infrared thermal camera for quantitative measurements and built the color schlieren for qualitative flow visualization. The color schlieren technique can already view the heat flow nearby the heat pipe as well as the copper pipe and compare the characteristics of heat transfer between the heat pipe and the copper pipe in the water.
The heat pipe owns the extreme large heat conductivity than the copper pipe and is often applied in CPU cooler in combination with cooling plates. The heat transfer of heat pipe uses the special technique, which is with help of the inside liquid evaporation for heat absorption and the inside micro-structural capillarity for condensation. This technique causes the instant heat transfer from heat source to the another side. After combination of the heat pipe with cooling plates will change this heat transfer characteristics. This work first built a CPU simulator in accordance with the ASTM standard for the heat pipe heating, then uses the color schlieren technique to visualize the sequent heat flux nearby the heat pipe and the infrared thermal camera for quantitative temperature measurements synchronously. The result shows that the heat flux first appears at the opposite side from the heat source and exhibits also the highest temperature in this side, which is reverse to the heat transfer characteristics of copper pipe. The result agrees to the theory completely. Another very interest result is that the heat flux of cooling plate nearest the heat source is first viewed then the others, which is similar to the combination with copper pipe.

並列關鍵字

CPU cooler ； heat pipe ； cooling plates ； thermal resistance measuring instrument ； infrared thermal camera ； color schlieren.

參考文獻

60.蔡聲鴻，均熱片之製造與分析，碩士論文，淡江大學，台北，2005。

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