含氫類鑽碳(a-C:H)與摻雜銅元素(Cu/a-C:H)沉積於玻璃基板上,使用射頻電漿和磁控濺鍍沉積過程中,通入不同比例的Ar/CH4混合氣體。使用X-ray(XRD)、拉曼光譜儀、高解析穿透式電子顯微鏡(TEM)與奈米壓痕…等相關測試,觀察Cu的含量對a-C:H薄膜之結構與特性的影響,利用大腸桿菌(E.coli)來評估Cu/a-C:H薄膜之抗菌活性。 TEM與XRD的結果顯示,在玻璃基材上沉積之a-C:H複合薄膜中含有奈米銅顆粒。拉曼光譜結果顯示,由於摻入的Ag和Cu對 a-C:H膜的結構有很大改變,對大腸桿菌(E.coli),Cu/a-C:H薄膜具有優越的抗菌活性,這表示其薄膜可適用於心血管支架的表面塗層應用。
A hydrogenated diamond-like carbon (a-C:H) with a copper dopant (Cu/a-C:H) was deposited on glass substrates using a combined radio-frequency plasma and magnetron sputtering deposition process under various Ar/CH4 gas mixtures. The effects of the Cu content on the structure and properties of the a-C:H matrix were investigated using X-ray diffraction (XRD), Raman transmission electron microscopy, high-resolution transmission electron microscopy (TEM), and nano-indentation. The bacterial activity of a Cu/a-C:H film was evaluated with Escherichia coli (E. coli). TEM images and XRD spectra demonstrated that composite films containing copper nanoparticles embedded in the a-C:H were deposited on the glass substrates. The Raman spectra showed the structure of a-C:H film was substantially changed by the incorporation of Ag and Cu. The Cu/a-C:H films offered superior antibacterial activity against E. coli indicating that they could be suitable for surface coatings in cardiovascular applications.