- 學位論文
自組裝單層衍生全程濕式銅金屬化在直通矽穿孔之應用
Feasibility of Using Self-assembled Monolayers to Derive All-wet Copper Metallization for Through-Silicon Vias (TSVs)
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延伸閱讀
- 李峻廷（2016）。全濕式無電鍍銅金屬化於直通矽穿孔之完全填充展示〔碩士論文，逢甲大學〕。華藝線上圖書館。https://doi.org/10.6341/fcu.M0311450
- 曾凱威（2018）。溼式蝕刻矽基板上直流磁控濺鍍氮化鋁薄膜特性研究〔碩士論文，中原大學〕。華藝線上圖書館。https://doi.org/10.6840/cycu201800810
- 吳庭孝（2012）。利用快速熱熔再結晶法製作金半金結構之面收型鍺紅外光光子偵測器於矽基板上〔碩士論文，國立清華大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0016-0908201218152724
- Chen, C. F. (2008). Study on Plasmonic Properties of Colloidal Nanoparticles Controlled by Self-Assembled Monolayers [doctoral dissertation, National Tsing Hua University]. Airiti Library. https://www.airitilibrary.com/Article/Detail?DocID=U0016-0903200911353619
- Chen, C. F. (2008). Study on Plasmonic Properties of Colloidal Nanoparticles Controlled by Self-Assembled Monolayers [doctoral dissertation, National Tsing Hua University]. Airiti Library. https://www.airitilibrary.com/Article/Detail?DocID=U0016-2002201314310150