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  • 學位論文

不飽和聚酯樹脂硬化反應研究

Curing Reaction of Unsaturated Polyester Resins

指導教授 : 余子隆
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摘要


工業界中不飽和聚酯樹脂的配方中常加入填充料、玻璃強化纖維及低收縮 劑(Low-Profile Additives,LPA)以改善產品品質。本研究利用膠體滲透 層析儀 (GPC)、動態光散射儀 (DLS) 及微差掃描熱卡計 (DSC) 研究添加 低收縮劑 (LPA) (PVAc和PMMA) 至不飽和聚酯樹脂 (UPE) 中對於硬化反 應的影響。藉由DSC可測得硬化反應趨勢,而不飽和聚酯樹脂與苯乙烯硬 化反應其初期之微膠粒粒徑變化則可由GPC及 DLS量測得知。 DSC部分實 驗結果顯示硬化反應速率隨著低收縮劑濃度之增加而降低。在固定低收縮 劑濃度下,硬化反應速率則由於低收縮劑與不飽和聚酯樹脂混合相容性之 降低而降低。而GPC與DLS部分實驗結果顯示由於Intra-molecular和 Inter-molecular反應的差異,不飽和聚酯樹脂在硬化反應初期微膠成形 的大小與結構深受低收縮劑濃度和低收縮劑對不飽和聚酯相容性優劣的影 響。

關鍵字

不飽和聚酯 微膠 低收縮劑 DSC DLS GPC

並列摘要


The effect of low profile additives (LPA), i.e. poly (vinyl acetate) (PVAc) and poly (methyl methacrylate) (PMMA), on the curing reaction of unsaturated polyester (UPE) resins was studied by gel permeation chromatography (GPC); dynamic light scattering (DLS) and differential scanning calorimetry (DSC). The curing reaction profiles were determined by DSC; whilst DLS and GPC were used to investigate the variation of the size of microgel particles during the early stage of curing reaction in UPE-styrene resins. The DSC experimental results indicated that the curing reaction rate decreased as the concentration of LPA increased. At a fixed LPA concentration, the curing reaction rate was slower for resins mixed with LPA possesing worse compatibility with UPE resins. During the early stage of curing reaction, the size and structure of the UPE microgels formation strongly depend on the concentration of LPA and also on the compatibility of the components in the curing system. The experimental results of this study revealed that the concentration of LPA and the compatibility of LPA with UPE resins had a strong influence on the polyester microgel formation and the curing behavior.

並列關鍵字

Unsaturated Polyester Microgel Low-profile additives DSC DLS GPC.

被引用紀錄


孫梅卿(1997)。不飽和聚酯樹脂摻合低收縮劑之凝膠行為光散射研究〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-0112200611353300
陳志澂(2002)。熱可塑性聚合體摻合熱固性樹脂硬化反應形態學研究〔碩士論文,元智大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0009-0112200611315055

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