球陣排列印刷電路基板中BT樹脂/銅界面接著破壞研究

The Study of the Premature Delamination of BT prepreg/Cu Interface in the Inner Layer of Ball Grid Array Circuit Board

葉青賢(Yeh Ching Hsien)

指導教授 ： 洪信國

元智大學/工程學院/化學工程與材料科學學系/碩士(1998年)

摘要

本研究在探討球陣排列（PBGA或enhanced BGA）電路基板中Bismaleimide-Triazine (BT)樹脂與銅面接著介面成份，接著不良之成因與改良方法。由Differential Scanning Calorimeter (DSC)及Attenuated Total Reflection Infrared Spectroscopy (ATR)光譜中得知，銅氧化物會催化BT樹脂之硬化，且由ATR中1564 cm-1及1368 cm-1之triazine變化速率證實，氧化銅催化BT樹脂之硬化效果較氧化亞銅佳，此外不同之銅氧化物會造成聚合物接著界面之選擇性吸附，由ATR中與氧化銅熱壓之樣品其1713 cm-1 bismaleimide五元環吸收峰遠比與氧化亞銅熱壓者明顯，由此得知氧化銅較氧化亞銅易吸附bismaleimide至界面，且Electron Spectroscopy for Chemical Analysis（ESCA）更進一步證實與氧化銅熱壓之BT界面含bismaleimide及oxazolidone量較與氧化亞銅熱壓者多，且經ATR之KRS-5(45O)光譜中計算得知其影響深度至少至2.5μ以上。
另由Thermogravimetric Analyzer (TGA)發現銅氧化物亦會催化BT樹脂劣化反應，銅氧化物會讓BT樹脂起始劣化溫度降低，此部份亦可由ATR不同探測深度之光譜比較得知，較接近銅氧化物之BT樹脂劣化物之生成速率較內層快速，且氧化銅之催化效果較氧化亞銅顯著。

關鍵字

球陣排列電路基板 ； BT樹脂 ； 氰酸酯 ； 銅箔 ； 接著 ； 介面分析

並列摘要

The objectives of this study are to investigate the chemical composition changes and the resulted premature delamination of the Bismaleimide-triazine (BT)/Cu prepreg interface in the inner layer of a Ball Grid Array (BGA) circuit board. From results of Differential Scanning Calorimeter (DSC) and Attenuated Total Reflection Infrared Spectroscopy (ATR), it is confirmed that both CuO and Cu2O can promote the curing reaction of BT and the formation of triazine and oxazolidone groups. The effect is greater from the BT/CuO than from the BT/ Cu2O. ATR analyses indicate that the amounts of BMI in the interfacial region of BT/CuO are more than those in BT/Cu2O. The presence of abundant BMI and oxazolidone groups in the BT/CuO interface is confirmed by the Electron Spectroscopy for Chemical Analysis (ESCA).
The catalytic degradation of the BT resin on the copper surfaces is also confirmed by the ATR and Thermogravimetric Analyzer (TGA) analyses. The result of the TGA indicates that the addition of copper oxides results in a decrease of the initial degradation temperature of the BT. The degradation rate is in the order of blank BT > Cu2O > CuO. The formation of epoxy-substituted carbamate and multi-substituted aromatic compounds accompanying with the scission of triazine and hydrocarbon bonds on the surface layer of BT are shown in the ATR spectra.

並列關鍵字

Ball Grid Array (BGA) circuit board ； Bismaleimide-Triazine resin (BT) ； cyanate ester ； Copper ； adhesion ； interface analysis

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