回收廢棄電路板製造高分子複合材料之研究

本研究主要之目的為將回收的廢棄印刷電路板(Wasted Printed Circuit Boards ， WPCB )，添加於高分子材料中，做為補強填充劑，製成複合材料，以提供一解決廢棄電路板（ WPCB ）之方法。製成材料之性質以熱示差分析儀（ Differential Scanning Calorimetry ， DSC），機械強度試驗與掃瞄電子顯微鏡( Scanning Electron Microscope， SEM )測試。由 DSC 結果可知， PCB 的加入會影響不飽合聚酯樹脂（ Uunsaturated Polyester ， UP ）之自由基硬化反應而降低起始硬化速率、延遲反應最快時間、改變樹脂聚合轉化率。 PCB加入之複合材料因有玻璃纖維及纁鬩藋蚽鉞o散破壞能量，故較無 PCB之 UP 強及韌。 UP 之衝擊能量隨著加入 PCB 量之增加而提高， 0.75 mm 尺寸 PCB 在提高 UP 之韌性上較 0.25 mm 尺寸 PCB 有效。但使用 0.25 mm 之 PCB 補強材料卻較 0.75 mm PCB 製成之複合材料有較高之拉伸及撓曲強度。以 UP 而言，可最多加入 150 phr之 PCB 填充劑。 PCB 之尺寸大小， PCB 中玻璃纖維之多寡， PCB於 UP 中之分散程度均會影響製成複合材料之性質。 GMA Glycidyl methacrylate ）表面處理會降低成型 UP 材料之性質，而矽烷（ Silane ）耦合劑表面處理會增強成型 UP 材料之性質。由 SEM 可知，材料之破壞均始於 UP 聚合物本身。事業廢棄物毒性溶出實驗證明 0.75 mm PCB 製成之複合材料銅溶出量較低；銅離子污染性較低， 0.25 mm 之 PCB 製成之複合材料銅溶出量較高，但添加至 150 phr 以上 0.75 mm 及 0.25 mm PCB 之複合材料皆能合於環保標準（銅毒性認定標準 15 ppm ）。以回收成本來看， 0.75 mm PCB 製成之複合材料有較佳之衝擊性能、低污染性、研碎 PCB 所需成本較低，非常符合回收之基本要求；但以回收再製複合物材料物性來看， 0.25 mm PCB 及 Silane 表面處理製成之複合材料有較佳之彎曲及拉伸強度，其應用層面及經濟上之價值較高但相鵀茖它^收成本亦高。本研究證實自 WPCB 製造複合材料之可行。

關鍵字

不飽合聚酯樹脂；廢棄印刷電路板；複合材料；回收；機械測試

並列摘要

The feasibility of using waste printed circuit boards (PCB) as reinforcing fillers in manufacturing composite materials isd using infrared spectroscopy, differential scanning calorimetry (DSC), mechanical test, and scanning electron microscopy (SEM). From measurement, it was obtained that the addition of PCB couldthe free radical reaction of the unsaturated polyester (UP) resin and decrease curing rates at the beginning stages, and lower theate conversion. The methods of surface treatments also affected thering reaction of the UP resin. PCB added UP resins all have higher Tg, tougher, and stronger than the unmodified UP because of energy dissipation effects ofass fibers and rigid epoxy resins in the PCB. The impact energy ofe specimen increased with increasing the loading of the added PCB powders. The 0.75 mm PCB was more effective in promoting the toughness of the UP matrix than 0.25 mm PCB. While 0.25 mm PCB added specimens were stronger than 0.75 mm PCB reinforceds. As much as 150 parts per hundred PCB can be added in the UP. The size of added PCB, the amounts of glass fibers, and the degree ofrsion of PCB in the UP all can affect properties of the moldedThe glycidyl methacrylate (GMA) treated PCB deteriorated thes of the UP but Z-6030 silane was effective in promoting the properties of the molded composites . From SEM pictures ofre surfaces impact specimens, it was obtained that the fracture wasnitiated from the resin matrix for all specimens tested and few copper was detected on the fracture surfaces. Moreover,all molded composites satisfied the copper evolution requirement of the EPA. All PCB added composites had evolution concentrations of copper ions below 15 parts per million (ppm)the specimens modified with 0.75 mm PCB had the lowest concentrationf copper ion. Production of UP composites from waste PCB wased.

並列關鍵字

Uunsaturated Polyester ； waste printed cricuit es ； mechanical test

國際替代計量

回收廢棄電路板製造高分子複合材料之研究

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