本論文將以各種封裝方式及不同元件設計來解決光次模組在高功率下雷射光在TOSA內部產生的反射導致量測上的誤差。同時並利用光學模擬軟體來作事前理論上的分析,再配合實際封裝測試,達到理論與實際相互結合。
The thesis will use different packaging modules/analyses and different component designs to investigate the relationship between Laser Diode (LD) light beam reflection phenomena in Transmitter Optical Sub-Assembly(TOSA) packages and the error margins from their measurements . In the meantime , we will use optical simulation software to analyze the related problems to perform the comparative packaging studies and present research results .