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  • 學位論文

在光次模組不同封裝上對雷射二極體光束反射現象之分析與研究

The Investigation of Laser Diode (LD) light beam reflection phenomena in various Transmitter Optical Sub-Assembly (TOSA) Packages

指導教授 : 王 仲 淳
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摘要


本論文將以各種封裝方式及不同元件設計來解決光次模組在高功率下雷射光在TOSA內部產生的反射導致量測上的誤差。同時並利用光學模擬軟體來作事前理論上的分析,再配合實際封裝測試,達到理論與實際相互結合。

關鍵字

光次模組

並列摘要


The thesis will use different packaging modules/analyses and different component designs to investigate the relationship between Laser Diode (LD) light beam reflection phenomena in Transmitter Optical Sub-Assembly(TOSA) packages and the error margins from their measurements . In the meantime , we will use optical simulation software to analyze the related problems to perform the comparative packaging studies and present research results .

並列關鍵字

TOSA

參考文獻


2. W.H. Cheng, W.H. Wang, H.Y. Chen, and H.H. Lin, “ Reduction of Micromovement in Optoelectronic Packaging,”IEEE Lasers and Electro-Optics Conference Proceedings, Vol.1,pp.248-249,1995.
3. J.M. Trewhella, G.W. Johnson, W.K. Hogan, and D.L. Karst, “ Evolution of optical subassemblies in IBM data communication transceivers,” pp.251-258,2003.
4. C.H. Hung,“ Optical Transceiver Module,” United States Patent No. 6.538.901 B1, Taipei, Mar.25, 2003.
參考文獻
1. S.C. Wang, H.L. Chang, C. Wang, C.M. Wang, J.W. Liaw, M.T. Sheen, J.H. Kuang, C.P. Chien, G.L. Wang, and W.H. Cheng, “ Post-Weld-Shift in Semiconductor Laser Packaging,”IEEE Electronic Components and Technology, pp.1159-1163,1999.

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