- 學位論文
甲醛對印刷電路板洗液中銅離子萃取回收之影響
Effect of Added Formaldehyde on Extraction Recovery of Cu(II) from Printed-Circuit-Board Rinse Water
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摘要
印刷電路板製造工廠在鍍通孔(Plating through hole，PTH)製程中大都採用化學鍍銅(Electroless copper)方式，在電路板之非導體鑽孔壁上沉析一層金屬銅，將其導體化以連接各板面之線路。製程中所排出之化學銅廢液及廢水，可能包含的污染種類有OH-、Cu2+及甲醛、EDTA等。由於此廢水中含有螯合劑EDTA與Cu2+會產生螯合作用，無法以一般傳統方式處理。本研究嘗試以溶劑萃取法回收化學銅洗液，並探討印刷電路板化學銅洗液中所含甲醛對銅離子萃取回收之影響。 本論文在探討鹼性萃取劑Aliquat 336於煤油中，與化學銅洗液於各種條件之萃取平衡。在萃取平衡方面，進料螯合銅濃度(1.57〜5 mol/m3)、甲醛濃度(0〜3 v/v %)、水相的pH0值(3〜8)、萃取劑Aliquat 336的濃度(80〜400 mol/m3)及操作溫度(288〜318 K)，對萃取平衡之影響。 結果顯示，在萃取系統中甲醛濃度越高分配比越高，水相之pHe值越高得分配比越高，但在pHe = 4.5以後，〔H+〕影響並不大，甚至高萃取劑濃度下反而下降，Aliquat 336濃度越高分配比越高，溫度越高分配比越高，螯合銅濃度越高分配比反而下降。 由CuL2-/H2O溶液與Aliquat 336/kerosene之液液萃取平衡，求得平衡常數表示式： (0 v/v% HCHO) (1 v/v% HCHO)
並列摘要
Discharges from the manufacturing of printed circuit boards such as plating through hole for electrodeless copper plating, often contain metal ions, complexing agents, and formaldehyde. The presence of strong complexing agents such as EDTA (ethylenediamine tetraacetic acid) cannot be satisfactorily handled using conventional precipitation methods and coagulation/flocculation processes such as hydroxides and sulfides. Furthermore, the high buffer capacity provided by complexing agents requires excessive amounts of chemicals to neutralize the alkalinity. These problems and restrictions warrant investigations on other recovery alternatives. In this paper, the feasibility of solvent extraction for remove of Cu(II) from industrial effluents was studied. The effect of formaldehyde on extraction of Cu(II) from an equimolar EDTA solution to an organic phase (Aliquat 336, n-decanol, and kerosene) was investigated. Experiments were conducted as a function of the initial feed concentration of CuL2- (1.57~5 mol/m3), solution pH (3~8), the extractant concentration (80~400 mol/m3), and formaldehyde concentration (0~3 v/v %) at 298 K. The distribution ratio (D) increased with increasing solution pH and reached the plateau at pH 4.5. The values of D increased with increasing Aliquat 336 concentration and with decreasing initial Cu(II) concentration. The extraction of Cu(II) was enhanced by the addition of formaldehyde. A semi-empirical model with three parameters was proposed to describe the equilibrium behavior, in which the non-idealities in both aqueous and organic phases were considered. In CuL2-/H2O and Aliquat 336/kerosene system, the equilibrium constant was obtained as follows: (0 v/v% HCHO) (1 v/v% HCHO)
並列關鍵字
HASH(0xc45f024)參考文獻
行政院環境保護署，「放流水標準」，行政院環境保護署(2003修正發布)。
莊瑞鑫、林素霞，「薄膜接觸器於重金屬廢水處理上之應用」，化工，第49 期，第61至69頁(2002)。
鄭文鋒、尹庚鳴、許吉昌，「印刷電路板電鍍製程簡介」，化工，第50期第4卷，第9至13頁(2003) 。
Alonso, A. I.; Urtiaga, A. M.; Irabien, A.; Ortiz, I. “Extraction of Cr(VI) with Aliquat 336 in hollow fiber contactors: Mass transfer analysis and modeling,” J. Membr. Sci., 49, 901-911 (1994).
Alonso, A. I.; Galan, B.; Irabien, A.; Ortiz, I. “Separation of Cr(VI) with Aliquat 336: Chemical equilibrium modeling,” Separ. Sci. Technol., 32, 1543-1555 (1997).