防焊感光綠漆合成製作

The Synthesis Of Liquid Solder Mask

李政翰(Cheng-Han Lee)

指導教授 ： 洪信國

元智大學/工程學院/化學工程與材料科學學系/碩士(2001年)

摘要

無資料

關鍵字

防焊綠漆 ； 結合劑 ； 酸價 ； 顯影能力

並列摘要

The object this research is to formulate a polymeric photoresist used as a solder mask in printed circuit board that has the good developable property, resolution, and soldering resistance. The effects of variables in polymerizing the binder such as the polymerization temperature, the relative amount of constituents, and the initiator content on the performance of the photoresist are studied. The results of tests indicate that with the proper formulation and the use of binder with a molecular weight of 25000~32000 and an acid value near 67~78, the formulated solder mask have a great resolution and developable property. The adhesion strength, soldering resistance, surface hardness, and appearance of the final product all meet the industrial standards.

並列關鍵字

solder mask ； photoresist ； acid value ； printed circuit board ； resolution

參考文獻

【18】J.-P. Fouassier, 〝Photoinitiation Photopolymerization and

Photocuring〞, Hanser, 1995.

【20】G.Odian,.Ed.〝Principles of Polymerization〞,3rd Ed, johnWiley

& Sons New York, 1991.

【25】 J. L. Koenig, 〝 Spectroscopy of Polymer〞, Am. Chem. Soc.,