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  • 學位論文

銅箔基板產業的經營策略研究- 以個案公司為例

Case Study of Business Strategies in Copper Clad Laminate Industry

指導教授 : 林玥岑
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摘要


印刷電路板為各項電子產品不可或缺的零組件之一,根據市調機構Prismark的統計,2008年全球電路板的產值為482.3億美金,而銅箔基板則是電路板製作過程中最重要的原料,2008年全球銅箔基板業者產值為80億美金,依據歷年的資料,基板與電路板產值比率約接近20%左右。 台灣印刷電路板的發展已經超過了四十年,在全世界的相關產業中具有相當的競爭力,其中很重要的因素即為台灣電路板產業具有完整的供應鏈,身處上游材料供應者的銅箔基板業者即為重要的一環。原本銅箔基板屬於不被重視的產業,但由於近幾年環保議題使電路板需求材料特性不斷改變,銅箔基板業者必須開發符合環保規範的無鉛材料、無鹵素基板等,才使得業者有較明顯競爭形態的轉變,掌握此綠色工業革命的銅箔基板業者才有了展露頭角的機會。 本研究探討了銅箔基板業者近幾年的轉變,以環境分析、策略理論、個案研究等方法,尋找近幾年產業中發展最為迅速的業者為研究對象,探討其策略方向及未來發展,並整理相關研究做為個案及其它經營者參考,希對銅箔基板產業有所助益。

並列摘要


PCB (Printed Circuit Board) is one of the crucial Electronic Parts & Components. According to research firm Prismark, global PCB production value in 2008 is USD 48.2billion dollars, and the global CCL (Copper Clad Laminate) production value in 2008 is USD 8 billion dollars; the CCL is the most important material for producing PCB. Per historical statistic showed the production value rate of PCB and CCL is like come to 20%. PCB industry in Taiwan has already developed for more than four decades, and it gets high competitiveness all over the world. The most important factors are that there is a completed supply chain in Taiwan’s PCB industry and CCL material suppliers. In the past years, CCL industry only got little attention. However the Eco issues these years caused the Material characteristics of PCB to change, the CCL industry need to develop the eco-friendly material, such as Lead free material、Halogen free substrate etc. This also makes CCL industry through green revolution have more competitiveness with each other and get more attention from the whole PCB market. This research is to find out what are the changes of CCL industries in recent years with the following research methods: Industry Environment, Strategic Theory, Case Study. Also did a case study on the rapid growth companies for their strategic direction and future development for providing reference to other company owners. Hope this research paper will be benefit to the industry.

參考文獻


1.聯茂電子股份有限公司(2008),上市公開說明書,30-42。
中文書
1. 楊政學(2006),企業管理綜合個案研究,台北,新文京開發,72-100。
2. 中山大學企業管理學系(2007),管理個案集-實務解析與應用,台北,前程文化,18-24。
3. 司徒達賢(2003),策略管理案例解析-觀念與實例,台北,智勝文化,16-25。

被引用紀錄


林奇霆(2012)。變動鄰域搜尋法於IC載板鑽孔路徑問題之應用〔碩士論文,元智大學〕。華藝線上圖書館。https://doi.org/10.6838/YZU.2012.00299

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