電子元件於太空環境之熱分析研究

Thermal Analysis of Electronics in Space Environment

張智鈞(Chin-Chun Chang)

指導教授 ： 林育才

元智大學/工程學院/機械工程學系/碩士(2008年)

摘要

本文主要利用數值模擬軟體FLOTHERM分別探討電子封裝元件位於一般大氣以及太空環境之溫度分佈情況。首先假設封裝元件處於大氣環境，改變封裝元件的形式以及晶片發熱面積、晶片功率和風速大小等參數變化，討論不同封裝元件的溫度分佈以及對熱阻的影響，最後比較完整模型與精簡模型之間的差異。在第二部份中，假設物理模型為太空環境軌道中所運行的衛星系統，採用被動式散熱的分析模式來探討電子封裝元件在太空環境下受熱的情況，試圖改變印刷電路板內單位體積之含銅量，以及改變多層隔熱系統分析阻絕外界能量的能力，規劃內部結構的設計，或是在衛星表面塗佈不同表面特性的材料，討論衛星熱控制對系統整體的改變，最後利用變異數分析歸納影響系統的重要參數。

關鍵字

電子封裝元件 ； 精簡模型 ； 衛星熱控制 ； 變異數分析

並列摘要

This paper were investigated the electronics thermal distribution in general atmosphere and space environment, respectively by FLOTHERM simulation. First of all, the packages assume that atmospheric environment, try to discussion the thermal performance of packages, the area of the heat source, the power of chip, and the inlet air velocity have been investigated the different of thermal resistance, finally to compare the different between complete model and compact model. In the second part, the assumption that physical model of satellite system for the operational orbit in the space, analysis the passive cooling of electronic packaging, try to change the percentage of copper in the printed circuit board, and the capability of multi-layer to insulation the outside energy, set up structure, or coating the surface characteristics of different materials, at the last, use the analysis of variance to find important parameters.

並列關鍵字

package components ； compact model ； satellite thermal control ； analysis of variance.

參考文獻

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