被動元件之厚膜電阻膠技術探討

A study on passive components of the thick film resistors

何思誼(Szu-Yi Ho)

指導教授 ： 黃振球

元智大學/工程學院/化學工程與材料科學學系/碩士(2012年)

摘要

電阻元件在消費性電子產品中以被大量使用，其功能為控制或限制線路中電流的流通量。在印刷電路板上要安裝為數眾多被動元件，已經成為非常困難之技術。
整合被動元件，空出更多表面積與空間以安裝更多之元件，已成為印刷電路板被動元件構裝之發展方向。其中厚膜電阻藉著其穩定性高且易加工優勢，已成為優先發展之重點。
本研究中先探討導電粒子碳黑與銀粉粒子添加量對厚膜電阻膠的導電度影響。並以田口穩健設計法得印刷條件對電阻值影響程度並求得最適化印刷條件。最終以雷射修阻之方法將電阻值精確控制在+/-1%內。
茲將本實驗研究結果摘要如下：
1. 180℃、30min 為碳黑(XE2B)厚膜電阻膠之最適化硬化條件。其臨界體積分率為25%。
2. 實驗求得碳黑(XE2B)之臨界體積分率為25%，也就是碳黑(XE2B)
pelocation threshould value，此與Janzen 方程式得之理論值22%相呼應，本研究結果與理論值得到相同的印證。
3. 室溫下電阻膠之導電率隨導電粒子之平均粒徑而成反比，此為較小之導電粒徑有較大之接觸表面積所致。
4. 奈米級碳黑(XE2B)或碳黑(XC72)混摻之電阻膠無法達到歐姆級電阻值(<10Ω)的需求，固須搭配銀粉方可達成。但添加過量碳黑會因高分子無法完整包覆而導致龜裂，須控制其添加量。
5.印刷因子對電阻值影響程度由大至小依序排列為:
刮刀速度>脫膜速度>刮刀壓力>擦拭頻率。
6.最佳的電阻膠印刷製程參數為:
(1)刮刀速度=30 mm/sec.
(2)脫膜速度=0.5 mm/sec.
(3)刮刀壓力=50 N.
(4)擦拭頻率=5PCB/次.
7.以雷射修阻方式可將厚膜電阻值控制在目標電阻+/-1％內。

關鍵字

導電粒子 ； 碳黑 ； 銀粉 ； 厚膜 ； 電阻

並列摘要

esistive elements are wildly used in the consumer electronics products, to control or limit the current. On the printed circuit board, how to install a large number of passive components has become a very important technology.
On the Integrate the passive components, for providing more surface area and space to install passive components, thick film resistors, because of the advantages of high stability and easy processing, has become the development direction of the passive components of the printed circuit board packaging.
In this study, first, we show the influence of the conductive particles content (with the carbon black and the silver particles) on the conductivity of polymer thick film resistors. We can know the influence of thick film printing parameter on resistance by Taguchi robust design. Finally, we used laser trimming technology to let the error percentage of resistance in ±1％.
It is the summary of the results of this study as below:
1. The suitable curing condition of thick film resistor blending with carbon black(XE2B) is 30 min at 180℃.
2. According to the experiments, the the critical volume fraction is 25%.It is comparable with the theoretical value of Janzen’s equation.
3. The conductivity is goint to become better on smaller particle.It is because the smaller particle have larger surface area, to get the higher contact possibility .
4. Conductive Film blending with the nano-scale carbon black (XE2B) or (XC72) can not be achieved ohm resistance value, so we needs to add the silver particle. If we add excess carbon black will induce polymer cracking, this is due to the polymer can’t fully cover all the carbon black.

5. Printing factor the impact of the resistance value sequentially arranged from large to small as below:
squeegee speed > stripping speed > squeegee pressure > clean frequency
6. The best printing process parameters are show as below:
(1) squeegee speed =30 mm/sec.
(2) stripping speed =0.5 mm/sec.
(3) squeegee pressure =50 N
(4) clean frequency =5PCB/time.
7. Using the laser trimming technology to let the error percentage of resistance in ±1％.

並列關鍵字

conductive particle ； carbon black ； silver ； thick film ； resistor

參考文獻

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