應用超音波檢測界面剛性與黏著強度

Ultrasonic Nondestructive Inspection on The Interfacial Stiffness and Adhesive Strength

林義川(Yi-Chuan Lin)

指導教授 ： 何旭川

元智大學/工程學院/機械工程學系/碩士(2006年)

https://doi.org/10.6838/YZU.2006.00305

摘要

本文以超音波非破壞檢測技術，檢測兩元件間接合界面，接合方式包含壓合與黏著兩種；壓合實驗係指在兩元件間施加壓力使其密合，又分為兩元件直接接觸之單一界面與中間含有薄夾層之雙層界面，黏著實驗則是以0.6mm膠層將兩元件接合。超音波檢測方式係將接合界面反射之時域訊號，以傅立葉快速轉換（FFT）至頻域，再以無接合界面之反射訊號為參考訊號進行反卷積（Deconvolution）求得界面反射係數與頻率之關係，進而計算出接合界面剛性。對壓合方式接合之界面，本文主要探討不同壓力下之界面剛性，並區分為相同材料與不同材料之接合。膠層黏接界面之探討則以改變環氧樹酯與硬化劑混合比方式調配出不同膠層，經由超音波反射係數訊號檢測不同混合比膠層黏著之界面剛性，再以拉伸實驗求得黏接強度與界面剛性之關係，結果顯示界面剛性愈大黏著強度愈好，實際應用上將可藉由超音波檢測界面剛性，瞭解兩物件間之黏接強度。

關鍵字

超音波檢測 ； 界面剛性 ； 黏著強度 ； 反卷積

並列摘要

It is common that many engineering structures are assembled from various components, and the strength of the structures depends heavily on the bonding. In this investigation, the ultrasonic technique is used for the nondestructive evaluation of the interphase between two components. Two different interphases are considered in this research. The first one named compressive interface is the interface of two components under compressive pressure. The second is named adhesive interfaces which bond two components together by the adhesive. The reflected waves from the interface are transformed to frequency domain by Fast Fourier Transform(FFT), and deconvolved with a reference signal taken from the interface with zero pressure. The interfacial stiffness are calculated from the frequency spectrum of the reflected waves. The interfacial stiffness of the compressive interface with various pressure are determined by ultrasonic technique. The strength of the adhesive interface is obtained by the tensile test.

並列關鍵字

ultrasonic technique ； interfacial stiffness ； adhesive strength ； deconvolution

參考文獻

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