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  • 學位論文

利用CMOS-MEMS技術單晶/垂直整合壓阻式觸覺感測器與電感式近接感測器

Monolithic/Vertical Integration of Piezo-resistive Tactile Sensor and Inductive Proximity Sensor Using CMOS-MEMS Technology

指導教授 : 方維倫
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摘要


智慧機器人的研發,受到廣泛的重視。為了協助機器人具備更良好的感知和人機互動的能力,觸覺感測可提供重要的外界訊息。若能整合觸覺感測器與近接感測器,則得以感知機械手臂與物體間之接觸力以及近接距離等資訊,以確保人機互動的安全,對於智慧機器人的應用格外重要。因此,本研究透過商用的標準半導體製程平台,TSMC 0.18μm 1P6M 以及0.35μm 2P4M,設計、製造、與整合壓阻式觸覺感測器與電感式近接感測器於單一晶片,並透過垂直整合的設計架構,有效縮小晶片的面積。本研究以螺旋線圈實現近接感測器,透過螺旋線圈的電感值變化,可以感測物體近接的距離;另外以內建壓阻式感測器之微機械結構實現觸覺力感測器,透過機械結構的形變和壓阻阻值的變化,可測得物體施與感測器的接觸力。由於電感和壓阻感測機制不會相互干擾,因此觸覺和近接感測單元可同時運作,所以本研究之感測晶片得以在物體接觸前後進行連續的監控,感測物體接觸前的近接距離和接觸後的接觸力。另外,為了滿足不同的應用需求,本研究除了開發簡易然而應用較廣泛的單軸正向接觸力感測器外,也開發較複雜但應用較特殊的三軸(正向與剪力)接觸力感測器。透過實驗的驗證,說明本研究提出的設計,達到預期的效果與能力。

並列摘要


To achieve more precise handling control and assure the safe interaction between human and robot, the integration of tactile and proximity sensing units is important for robot applications, for knowing the information of touching force and sensing distance between robot hands and objects. This study demonstrates the monolithic/vertical integration of piezo-resistive tactile sensor and inductive proximity sensor using standard TSMC 0.18μm 1P6M and 0.35μm 2P4M CMOS process. The footprint reduction of sensing chip is achieved by the vertical integration of tactile and proximity sensing units. Before contact, the distance change between object and sensor leads to the inductance change of spiral coil; after contact, the force applied on sensor leads to the resistance change of bent piezo-resistors. Simultaneous detection for tactile and proximity modes is achieved to enable continuous monitoring before/after contact of object. Besides, due to no interference between two sensing mechanism, tactile and proximity sensing units can work independently.

參考文獻


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