覆晶球柵陣列構裝於構裝製程後之熱機械行為分析與可靠度研究

On the Study of Process induced Thermal -mechanical Behaviors and Reliability for a Flip-Chip Ball Grid Array Packaging

莊詠程(Yung-Cheng Juang)

指導教授 ： 陳文華 ； 鄭仙志

國立清華大學/工學院/動力機械工程學系/碩士(2009年)

https://doi.org/10.6843/NTHU.2009.00042

摘要

現今電子構裝技術發展迅速，為了達到輕、薄、短、小及高傳輸速度、I/O接腳數多等需求，覆晶球柵陣列(flip-chip ball grid array, FC-BGA)構裝因應而生。而此一技術，在構裝製程以及可靠度評估中仍會出現許多問題，例如構裝在製程完畢後之翹曲行為，及其銲錫凸塊在歷經加速熱循環後產生的低週期熱疲勞破壞現象等，皆值得吾人深入探究。
本論文首先利用有限單元分析軟體ANSYS

關鍵字

覆晶球柵陣列構裝 ； 銅/低介電材料層 ； 熱機械行為 ； 翹曲 ； 加速熱循環 ； 有限單元全域/局部分析法 ； 疲勞壽命

並列摘要

Nowadays, electronic packages are developed very fast, therefore the flip-chip ball grid array package is devised for the purpose of achieving the requirements for something which is light, thin, short, small, high speed and high input/output pin counts. However the flip-chip ball grid array package, as a new technology, still has many technical challenges remaining in concern, such as the warpage behavior after the packaging process, and the low cycling thermal fatigue failure which is produced by the solder bump after the accelerated thermal cycling test. These features of the flip-chip ball grid array package in this research work worth further study.
Using the element death and birth technology and the finite element global/local analysis model, this study is first to establish an accurate three-dimensional finite element thermal-mechanical analysis model by the ANSYS finite element analysis software.Continuously,the integrated process-dependent analysis simulates for the thermal-mechanical properties which are produced from the chip with Cu/low-k layer of flip- chip ball grid array package after packaging process, including the warpage of the packaging and the strain/stress of the chip, solder bump and the different interfaces of surrounding materials. The validity of the thermal-mechanical analysis model is verified by robotic vision systems inspection (RVSI) and the Twyman-Green interferometry experiments for warpage measurement. In addition, this research explores the elasticity, plasticity and creep behaviors of the solder bump made by different materials, and predicts the fatigue life further when the flip-chip ball grid array package stays in the condition of the accelerated thermal cycling test. At last, this study investigates the effects of related process, materials and geometric parameters on the thermal-mechanical behaviors of this packaging through parametric analysis.
The achievement of this study can help us to understand the thermal-mechanical behaviors of the chip with Cu/low-k layer of flip-chip ball grid array package and the reliability under the accelerated thermal cycling test, also offer an initial design stage for electronic packaging industry.

並列關鍵字

flip-chip ball grid array package ； Cu/low-k layer ； thermal- mechanical behavior ； warpage ； accelerated thermal cycling ； global/local finite element approach ； fatigue life

參考文獻

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